Suda; Ryutaro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Suda; Ryutaro.The latest application filed is for "substrate processing method and plasma processing apparatus".
- Suda; Ryutaro - Miyagi JP
- SUDA; Ryutaro - Kurokawa-gun JP
| Patent | Date |
|---|---|
| Etching method Grant 11,456,180 - Yokoyama , et al. September 27, 2 | 2022-09-27 |
| Substrate Processing Method And Plasma Processing Apparatus App 20220285169 - SUDA; Ryutaro ; et al. | 2022-09-08 |
| Etching method Grant 11,417,530 - Yokoyama , et al. August 16, 2 | 2022-08-16 |
| Substrate Processing Method And Substrate Processing Apparatus App 20220246443 - SUDA; Ryutaro ; et al. | 2022-08-04 |
| Etching Method App 20220199412 - YOKOYAMA; Takahiro ; et al. | 2022-06-23 |
| Substrate processing method and plasma processing apparatus Grant 11,361,976 - Suda , et al. June 14, 2 | 2022-06-14 |
| Substrate processing method and substrate processing apparatus Grant 11,342,194 - Suda , et al. May 24, 2 | 2022-05-24 |
| Etching Method App 20220157610 - YOKOYAMA; Takahiro ; et al. | 2022-05-19 |
| Substrate Processing Method And Substrate Processing System App 20220157616 - KUMAGAI; Kae ; et al. | 2022-05-19 |
| Etching Method App 20220148884 - ORUI; Takatoshi ; et al. | 2022-05-12 |
| Etching Method And Plasma Processing Apparatus App 20220093367 - TANAKA; Koki ; et al. | 2022-03-24 |
| Etching Method And Etching Apparatus App 20220051899 - SUDA; Ryutaro ; et al. | 2022-02-17 |
| Method And Apparatus For Formation Of Protective Sidewall Layer For Bow Reduction App 20210375633 - SUDA; Ryutaro ; et al. | 2021-12-02 |
| Method and apparatus for formation of protective sidewall layer for bow reduction Grant 11,171,012 - Suda , et al. November 9, 2 | 2021-11-09 |
| Substrate Processing Method And Plasma Processing Apparatus App 20210343539 - SUDA; Ryutaro ; et al. | 2021-11-04 |
| Etching method and etching apparatus Grant 11,094,550 - Kumakura , et al. August 17, 2 | 2021-08-17 |
| Etching Method And Etching Apparatus App 20210202261 - SUDA; Ryutaro ; et al. | 2021-07-01 |
| Substrate Processing Method And Plasma Processing Apparatus App 20210159085 - SUDA; Ryutaro ; et al. | 2021-05-27 |
| Substrate Processing Method And Substrate Processing Apparatus App 20210159089 - SUDA; Ryutaro ; et al. | 2021-05-27 |
| Etching Method And Plasma Processing Apparatus App 20210143028 - YOKOYAMA; Takahiro ; et al. | 2021-05-13 |
| Etching Method App 20210143016 - YOKOYAMA; Takahiro ; et al. | 2021-05-13 |
| Etching Method And Etching Apparatus App 20200234963 - KUMAKURA; Sho ; et al. | 2020-07-23 |
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