loadpatents
name:-0.080521106719971
name:-0.053126811981201
name:-0.0056819915771484
Suda; Hisashi Patent Filings

Suda; Hisashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suda; Hisashi.The latest application filed is for "cu-ni-al based copper alloy sheet material, method for producing same, and conductive spring member".

Company Profile
4.16.17
  • Suda; Hisashi - Tokyo JP
  • Suda; Hisashi - Shizuoka N/A JP
  • Suda; Hisashi - Iwata N/A JP
  • Suda; Hisashi - Iwata-shi JP
  • Suda; Hisashi - Okayama-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cu--Co--Si-based copper alloy sheet material and method for producing the same, and component using the sheet material
Grant 11,332,815 - Hyodo , et al. May 17, 2
2022-05-17
Cu-Ni-Al BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CONDUCTIVE SPRING MEMBER
App 20210238724 - SHUTOH; Toshiya ;   et al.
2021-08-05
Cu-Ni-Si based copper alloy sheet material and production method
Grant 11,047,023 - Shutoh , et al. June 29, 2
2021-06-29
Cu-Co-Si-BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND COMPONENT USING THE SHEET MATERIAL
App 20200140982 - HYODO; Hiroshi ;   et al.
2020-05-07
Cu-Ni-Si BASED COPPER ALLOY SHEET MATERIAL AND PRODUCTION METHOD
App 20190106769 - SHUTOH; Toshiya ;   et al.
2019-04-11
Copper alloy plate and method for producing same
Grant 10,174,406 - Gao , et al. J
2019-01-08
Copper alloy sheet and method for producing same
Grant 9,994,933 - Gao , et al. June 12, 2
2018-06-12
Female terminal fabricating method
Grant 9,698,554 - Kubodera , et al. July 4, 2
2017-07-04
Manufacturing method of copper alloy sheet
Grant 9,493,859 - Gao , et al. November 15, 2
2016-11-15
Female terminal and method for fabricating female terminal
Grant 9,356,412 - Kubodera , et al. May 31, 2
2016-05-31
Female Terminal And Method For Fabricating Female Terminal
App 20150229092 - KUBODERA; Atsushi ;   et al.
2015-08-13
Cu--Ni--Si-based copper alloy sheet material and method of manufacturing same
Grant 9,034,123 - Gao , et al. May 19, 2
2015-05-19
Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component
Grant 8,992,702 - Gao , et al. March 31, 2
2015-03-31
Manufacturing Method Of Copper Alloy Sheet
App 20150053314 - Gao; Weilin ;   et al.
2015-02-26
Copper alloy plate and method for producing same
Grant 8,871,041 - Gao , et al. October 28, 2
2014-10-28
Female Terminal And Method For Fabricating Female Terminal
App 20130225017 - KUBODERA; Atsushi ;   et al.
2013-08-29
Copper Alloy Plate And Method For Producing Same
App 20120279618 - Gao; Weilin ;   et al.
2012-11-08
Cu-Ti-based copper alloy sheet material and method of manufacturing same
Grant 8,097,102 - Gao , et al. January 17, 2
2012-01-17
Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component
App 20110240180 - Gao; Weilin ;   et al.
2011-10-06
Copper Alloy Sheet And Method For Producing Same
App 20100269959 - Gao; Weilin ;   et al.
2010-10-28
Cu-Ti-based copper alloy sheet material and method of manufacturing same
App 20100139822 - Gao; Weilin ;   et al.
2010-06-10
Copper Alloy Plate And Method For Producing Same
App 20100132851 - Gao; Weilin ;   et al.
2010-06-03
Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
App 20080190523 - Gao; Weilin ;   et al.
2008-08-14
Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
App 20080190524 - Gao; Weilin ;   et al.
2008-08-14
Particulate matter oxidation catalyst and filter
App 20070105715 - Suda; Hisashi ;   et al.
2007-05-10
Perovskite complex oxide and catalyst
App 20060018815 - Suda; Hisashi
2006-01-26
Method of producing perovskite complex oxide and precursor substance used in the method
App 20040247511 - Mafune, Shuichi ;   et al.
2004-12-09
Perovskite complex oxide and method of producing the same
App 20040191150 - Yano, Takuya ;   et al.
2004-09-30

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