Subrahmanyam; Prabhakar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Subrahmanyam; Prabhakar.The latest application filed is for "thin form factor assemblies for cooling dimms".

Company Profile

7.3.15

Subrahmanyam; Prabhakar - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Jet vectoring fluid impingement cooling using pivoting nozzles Grant 11,439,037 - Subrahmanyam , et al. September 6, 2	2022-09-06
Thin Form Factor Assemblies For Cooling Dimms App 20220225542 - SUBRAHMANYAM; Prabhakar ; et al.	2022-07-14
Locking Tensioner Cooling Assembly For Pluggable Electronic Component App 20220210906 - SUBRAHMANYAM; Prabhakar ; et al.	2022-06-30
Liquid Cooling System Leak Detection Improvements App 20220196507 - SUBRAHMANYAM; Prabhakar ; et al.	2022-06-23
Liquid Cooled Cold Plate For Multiple Semiconductor Chip Packages App 20220173015 - SUBRAHMANYAM; Prabhakar ; et al.	2022-06-02
Enhanced Electronic Package Thermal Dissipation With In-situ Transpiration Cooling And Reduced Thermal Interstitial Resistance App 20220117112 - SUBRAHMANYAM; Prabhakar ; et al.	2022-04-14
Tunable Stack-up Dimm Form Factor Cold Plate With Embedded Peltier Devices For Enhanced Cooling Capability App 20220077023 - SUBRAHMANYAM; Prabhakar ; et al.	2022-03-10
Directly Impinging Pressure Modulated Spray Cooling And Methods Of Target Temperature Control App 20210351106 - SUBRAHMANYAM; Prabhakar ; et al.	2021-11-11
Self-healing, Target Temperature Load Balancing, And Related Technologies For Heat Exchanger Networks App 20210307199 - Subrahmanyam; Prabhakar	2021-09-30
Thermal Control For Processor-based Devices App 20210289659 - SUBRAHMANYAM; Prabhakar ; et al.	2021-09-16
Self Cooling Adaptive Flow Branching Heat Exchanger System For Cooling Of One Or More Semiconductor Chips App 20210120703 - SUBRAHMANYAM; Prabhakar ; et al.	2021-04-22
Optical Leak Detection Of Liquid Cooling Components Within An Electronic System App 20210116391 - SUBRAHMANYAM; Prabhakar ; et al.	2021-04-22
Reconfigurable thermal control of high-powered integrated circuitry Grant 10,973,154 - Chao , et al. April 6, 2	2021-04-06
Reconfigurable cooling assembly for integrated circuitry Grant 10,930,575 - Subrahmanyam , et al. February 23, 2	2021-02-23
Reconfigurable Thermal Control Of High-powered Integrated Circuitry App 20200229325 - CHAO; Tong W. ; et al.	2020-07-16
Reconfigurable Cooling Assembly For Integrated Circuitry App 20200027808 - SUBRAHMANYAM; Prabhakar ; et al.	2020-01-23
Jet Vectoring Fluid Impingement Cooling Using Pivoting Nozzles App 20190364691 - Subrahmanyam; Prabhakar ; et al.	2019-11-28

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