Subido; Willmar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Subido; Willmar.The latest application filed is for "wire bond wires for interference shielding".
- Subido; Willmar - San Jose CA
- Subido; Willmar - Garland TX
| Patent | Date |
|---|---|
| Wire Bond Wires For Interference Shielding App 20200118939 - Awujoola; Abiola ; et al. | 2020-04-16 |
| Wire bond wires for interference shielding Grant 10,559,537 - Awujoola , et al. Feb | 2020-02-11 |
| Embedded wire bond wires Grant 10,490,528 - Prabhu , et al. Nov | 2019-11-26 |
| Wire Bond Wires For Interference Shielding App 20190027444 - Awujoola; Abiola ; et al. | 2019-01-24 |
| Wire bond wires for interference shielding Grant 10,115,678 - Awujoola , et al. October 30, 2 | 2018-10-30 |
| Wafer-level packaging using wire bond wires in place of a redistribution layer Grant 10,008,469 - Katkar , et al. June 26, 2 | 2018-06-26 |
| Wire Bond Wires for Interference Shielding App 20180061774 - Awujoola; Abiola ; et al. | 2018-03-01 |
| Wire bond wires for interference shielding Grant 9,812,402 - Awujoola , et al. November 7, 2 | 2017-11-07 |
| Ball bonding metal wire bond wires to metal pads Grant 9,761,554 - Subido , et al. September 12, 2 | 2017-09-12 |
| Wire Bond Wires For Interference Shielding App 20170117231 - Awujoola; Abiola ; et al. | 2017-04-27 |
| Embedded wire bond wires App 20170103968 - PRABHU; Ashok S. ; et al. | 2017-04-13 |
| Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer App 20170069591 - Katkar; Rajesh ; et al. | 2017-03-09 |
| Coupling of side surface contacts to a circuit platform Grant 9,530,749 - Co , et al. December 27, 2 | 2016-12-27 |
| Wafer-level packaging using wire bond wires in place of a redistribution layer Grant 9,502,372 - Katkar , et al. November 22, 2 | 2016-11-22 |
| Ball Bonding Metal Wire Bond Wires To Metal Pads App 20160329294 - SUBIDO; Willmar ; et al. | 2016-11-10 |
| Wire bond wires for interference shielding Grant 9,490,222 - Awujoola , et al. November 8, 2 | 2016-11-08 |
| Coupling Of Side Surface Contacts To A Circuit Platform App 20160322325 - CO; Reynaldo ; et al. | 2016-11-03 |
| Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer App 20160322326 - KATKAR; Rajesh ; et al. | 2016-11-03 |
| Repackaging semiconductor IC devices for failure analysis Grant 6,521,479 - Harrison , et al. February 18, 2 | 2003-02-18 |
| Bonding pads for integrated circuits having copper interconnect metallization Grant 6,329,722 - Shih , et al. December 11, 2 | 2001-12-11 |
| Wire bonded flip-chip assembly of semiconductor devices Grant 6,268,662 - Test , et al. July 31, 2 | 2001-07-31 |
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