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name:-0.014579057693481
name:-0.0051369667053223
name:-0.0014021396636963
Subagio; Anang Patent Filings

Subagio; Anang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Subagio; Anang.The latest application filed is for "semiconductor device package with electromagnetic shielding".

Company Profile
0.14.15
  • Subagio; Anang - Batam Island ID
  • Subagio; Anang - Batan Island ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lead frame routed chip pads for semiconductor packages
Grant 8,304,864 - San Antonio , et al. November 6, 2
2012-11-06
Partially patterned lead frames and methods of making and using the same in semiconductor packaging
Grant 8,236,612 - San Antonio , et al. August 7, 2
2012-08-07
Semiconductor Device Package With Electromagnetic Shielding
App 20120126378 - San Antonio; Romarico S. ;   et al.
2012-05-24
RF shielding for a singulated laminate semiconductor device package
Grant 8,084,300 - San Antonio , et al. December 27, 2
2011-12-27
No Lead Package With Heat Spreader
App 20110304032 - Ramos; Mary Jean Bajacan ;   et al.
2011-12-15
No lead package with heat spreader
Grant 8,022,512 - Ramos , et al. September 20, 2
2011-09-20
Leadless semiconductor package and method of manufacture
Grant 7,943,431 - San Antonio , et al. May 17, 2
2011-05-17
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
App 20110111562 - San Antonio; Romarico S. ;   et al.
2011-05-12
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
App 20110057298 - Ramos; Mary Jean ;   et al.
2011-03-10
Lead Frame Routed Chip Pads For Semiconductor Packages
App 20110001224 - San Antonio; Romarico Santos ;   et al.
2011-01-06
Lead frame routed chip pads for semiconductor packages
Grant 7,820,480 - Islam , et al. October 26, 2
2010-10-26
Method for making QFN package with power and ground rings
Grant 7,816,186 - San Antonio , et al. October 19, 2
2010-10-19
Partially patterned lead frames and methods of making and using the same in semiconductor packaging
Grant 7,799,611 - Ramos , et al. September 21, 2
2010-09-21
Lead frame routed chip pads for semiconductor packages
Grant 7,795,710 - Islam , et al. September 14, 2
2010-09-14
Partially patterned lead frames and methods of making and using the same in semiconductor packaging
Grant 7,790,500 - Ramos , et al. September 7, 2
2010-09-07
Method of making thermally enhanced substrate-base package
Grant 7,741,158 - Leung , et al. June 22, 2
2010-06-22
Method of making flip-chip package with underfill
Grant 7,700,414 - San Antonio , et al. April 20, 2
2010-04-20
Semiconductor device package and method for manufacturing same
Grant 7,563,648 - Islam , et al. July 21, 2
2009-07-21
Partially patterned lead frames and methods of making and using the same in semiconductor packaging
App 20080258278 - Ramos; Mary Jean ;   et al.
2008-10-23
Lead frame routed chip pads for semiconductor packages
App 20080076206 - Islam; Shafidul ;   et al.
2008-03-27
Method of making thermally enhanced substrate-base package
App 20070284733 - Leung; Timothy ;   et al.
2007-12-13
Method for making QFN package with power and ground rings
App 20070215990 - San Antonio; Romarico S. ;   et al.
2007-09-20
No Lead Package With Heat Spreader
App 20070200207 - Ramos; Mary Jean Bajacan ;   et al.
2007-08-30
Die pad for semiconductor packages and methods of making and using same
Grant 7,262,491 - Islam , et al. August 28, 2
2007-08-28
Semiconductor device package and method for manufacturing same
App 20070161157 - Islam; Shafidul ;   et al.
2007-07-12
Leadless semiconductor package and method of manufacture
App 20070126092 - San Antonio; Romarico S. ;   et al.
2007-06-07
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
App 20070052076 - Ramos; Mary Jean ;   et al.
2007-03-08
Die pad for semiconductor packages and methods of making and using same
App 20070052070 - Islam; Shafidul ;   et al.
2007-03-08
Lead frame routed chip pads for semiconductor packages
App 20060151860 - Islam; Shafidul ;   et al.
2006-07-13

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