Patent | Date |
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Lead frame routed chip pads for semiconductor packages Grant 8,304,864 - San Antonio , et al. November 6, 2 | 2012-11-06 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 8,236,612 - San Antonio , et al. August 7, 2 | 2012-08-07 |
Semiconductor Device Package With Electromagnetic Shielding App 20120126378 - San Antonio; Romarico S. ;   et al. | 2012-05-24 |
RF shielding for a singulated laminate semiconductor device package Grant 8,084,300 - San Antonio , et al. December 27, 2 | 2011-12-27 |
No Lead Package With Heat Spreader App 20110304032 - Ramos; Mary Jean Bajacan ;   et al. | 2011-12-15 |
No lead package with heat spreader Grant 8,022,512 - Ramos , et al. September 20, 2 | 2011-09-20 |
Leadless semiconductor package and method of manufacture Grant 7,943,431 - San Antonio , et al. May 17, 2 | 2011-05-17 |
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging App 20110111562 - San Antonio; Romarico S. ;   et al. | 2011-05-12 |
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging App 20110057298 - Ramos; Mary Jean ;   et al. | 2011-03-10 |
Lead Frame Routed Chip Pads For Semiconductor Packages App 20110001224 - San Antonio; Romarico Santos ;   et al. | 2011-01-06 |
Lead frame routed chip pads for semiconductor packages Grant 7,820,480 - Islam , et al. October 26, 2 | 2010-10-26 |
Method for making QFN package with power and ground rings Grant 7,816,186 - San Antonio , et al. October 19, 2 | 2010-10-19 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,799,611 - Ramos , et al. September 21, 2 | 2010-09-21 |
Lead frame routed chip pads for semiconductor packages Grant 7,795,710 - Islam , et al. September 14, 2 | 2010-09-14 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,790,500 - Ramos , et al. September 7, 2 | 2010-09-07 |
Method of making thermally enhanced substrate-base package Grant 7,741,158 - Leung , et al. June 22, 2 | 2010-06-22 |
Method of making flip-chip package with underfill Grant 7,700,414 - San Antonio , et al. April 20, 2 | 2010-04-20 |
Semiconductor device package and method for manufacturing same Grant 7,563,648 - Islam , et al. July 21, 2 | 2009-07-21 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20080258278 - Ramos; Mary Jean ;   et al. | 2008-10-23 |
Lead frame routed chip pads for semiconductor packages App 20080076206 - Islam; Shafidul ;   et al. | 2008-03-27 |
Method of making thermally enhanced substrate-base package App 20070284733 - Leung; Timothy ;   et al. | 2007-12-13 |
Method for making QFN package with power and ground rings App 20070215990 - San Antonio; Romarico S. ;   et al. | 2007-09-20 |
No Lead Package With Heat Spreader App 20070200207 - Ramos; Mary Jean Bajacan ;   et al. | 2007-08-30 |
Die pad for semiconductor packages and methods of making and using same Grant 7,262,491 - Islam , et al. August 28, 2 | 2007-08-28 |
Semiconductor device package and method for manufacturing same App 20070161157 - Islam; Shafidul ;   et al. | 2007-07-12 |
Leadless semiconductor package and method of manufacture App 20070126092 - San Antonio; Romarico S. ;   et al. | 2007-06-07 |
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging App 20070052076 - Ramos; Mary Jean ;   et al. | 2007-03-08 |
Die pad for semiconductor packages and methods of making and using same App 20070052070 - Islam; Shafidul ;   et al. | 2007-03-08 |
Lead frame routed chip pads for semiconductor packages App 20060151860 - Islam; Shafidul ;   et al. | 2006-07-13 |