| Patent | Date |
|---|
Air Spacer Surrounding Conductive Features and Method Forming Same
App 20220310441 - Su; Yi-Nien ; et al. | 2022-09-29 |
Integrated circuit and method for manufacturing the same
Grant 11,456,210 - Huang , et al. September 27, 2 | 2022-09-27 |
Method Of Forming A Semiconductor Device
App 20220262674 - Su; Yi-Nien ; et al. | 2022-08-18 |
Method for manufacturing semiconductor structure
Grant 11,355,642 - Hsu , et al. June 7, 2 | 2022-06-07 |
Method of forming a semiconductor device
Grant 11,322,393 - Su , et al. May 3, 2 | 2022-05-03 |
Integrated Circuit And Method For Manufacturing The Same
App 20220115266 - HUANG; KUAN-WEI ; et al. | 2022-04-14 |
Patterning Material Including Silicon-containing Layer And Method For Semiconductor Device Fabrication
App 20220102150 - TUNG; Szu-Ping ; et al. | 2022-03-31 |
Self-Aligned Via Formation Using Spacers
App 20220102212 - Su; Yi-Nien ; et al. | 2022-03-31 |
Patterning Material Including Carbon-containing Layer And Method For Semiconductor Device Fabrication
App 20220102200 - TUNG; Szu-Ping ; et al. | 2022-03-31 |
Method For Reducing Line End Spacing And Semicondcutor Devices Manufactured Thereof
App 20220102198 - SU; YI-NIEN ; et al. | 2022-03-31 |
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof
App 20220102192 - Su; Yi-Nien ; et al. | 2022-03-31 |
Lithography Method To Reduce Spacing Between Interconnect Wires In Interconnect Structure
App 20220093455 - Su; Yi-Nien ; et al. | 2022-03-24 |
Method of Forming a Semiconductor Device
App 20210134657 - Su; Yi-Nien ; et al. | 2021-05-06 |
Method Of Manufacturing Semiconductor Devices
App 20210096473 - LIU; Ru-Gun ; et al. | 2021-04-01 |
Method of forming a semiconductor device
Grant 10,867,840 - Su , et al. December 15, 2 | 2020-12-15 |
Patterning method for semiconductor device and structures resulting therefrom
Grant 10,867,804 - Su December 15, 2 | 2020-12-15 |
Semiconductor methods and devices
Grant 10,840,097 - Su November 17, 2 | 2020-11-17 |
Method of Forming a Semiconductor Device
App 20200105585 - Su; Yi-Nien ; et al. | 2020-04-02 |
Method For Manufacturing Semiconductor Structure
App 20200052122 - HSU; Ju-Wang ; et al. | 2020-02-13 |
Patterning Method For Semiconductor Device And Structures Resulting Therefrom
App 20200006082 - Su; Yi-Nien | 2020-01-02 |
Fin field effect transistor and method of forming the same
Grant 10,483,397 - Hsu , et al. Nov | 2019-11-19 |
Semiconductor Methods And Devices
App 20190237333 - Su; Yi-Nien | 2019-08-01 |
Semiconductor methods and devices
Grant 10,276,381 - Su | 2019-04-30 |
Method for forming semiconductor structure
Grant 10,109,522 - Su , et al. October 23, 2 | 2018-10-23 |
Semiconductor Methods And Devices
App 20180151363 - Su; Yi-Nien | 2018-05-31 |
Semiconductor methods and devices
Grant 9,881,794 - Su January 30, 2 | 2018-01-30 |
Semiconductor devices and methods of manufacture thereof
Grant 9,530,728 - Sung , et al. December 27, 2 | 2016-12-27 |
Method For Forming Semiconductor Structure
App 20160358816 - Su; Yi-Nien ; et al. | 2016-12-08 |
Method for forming semiconductor structure
Grant 9,425,091 - Su , et al. August 23, 2 | 2016-08-23 |
Interconnect structure and method of forming the same
Grant 9,355,894 - Sung , et al. May 31, 2 | 2016-05-31 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20150380352 - Sung; Su-Jen ; et al. | 2015-12-31 |
Method For Forming Semiconductor Structure
App 20150318206 - Su; Yi-Nien ; et al. | 2015-11-05 |
Semiconductor devices and methods of manufacture thereof
Grant 9,129,965 - Sung , et al. September 8, 2 | 2015-09-08 |
Interconnect Structure and Method of Forming the Same
App 20150235894 - Sung; Su-Jen ; et al. | 2015-08-20 |
Damascene gap structure
Grant 9,082,770 - Su , et al. July 14, 2 | 2015-07-14 |
Interconnect structure and method of forming the same
Grant 9,041,216 - Sung , et al. May 26, 2 | 2015-05-26 |
Fin Field Effect Transistor And Method Of Forming The Same
App 20150137265 - HSU; Ju-Wang ; et al. | 2015-05-21 |
Fin field effect transistor and method of forming the same
Grant 8,927,353 - Hsu , et al. January 6, 2 | 2015-01-06 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140264895 - Sung; Su-Jen ; et al. | 2014-09-18 |
Interconnect Structure And Method Of Forming The Same
App 20140264880 - Sung; Su-Jen ; et al. | 2014-09-18 |
Deposition Injection Masking
App 20140272135 - Chang; Chih-Chiang ; et al. | 2014-09-18 |
Damascene Gap Structure
App 20140110845 - Su; Yi-Nien ; et al. | 2014-04-24 |
Dual damascene interconnect in hybrid dielectric
Grant 8,415,799 - Su , et al. April 9, 2 | 2013-04-09 |
Contact hole structures and contact structures and fabrication methods thereof
Grant 7,875,547 - Hsu , et al. January 25, 2 | 2011-01-25 |
Method for photoresist stripping and treatment of low-k dielectric material
Grant 7,598,176 - Tsai , et al. October 6, 2 | 2009-10-06 |
Fin Filled Effect Transistor And Method Of Forming The Same
App 20080277745 - Hsu; Ju-Wang ; et al. | 2008-11-13 |
Via structures and trench structures and dual damascene structures
Grant 7,436,009 - Huang , et al. October 14, 2 | 2008-10-14 |
Measuring low dielectric constant film properties during processing
Grant 7,400,401 - Tsai , et al. July 15, 2 | 2008-07-15 |
Via structures and trench structures and dual damascene structures
App 20070184669 - Huang; Yi-Chen ; et al. | 2007-08-09 |
Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof
Grant 7,217,663 - Huang , et al. May 15, 2 | 2007-05-15 |
Method of making dual damascene with via etch through
Grant 7,196,002 - Su , et al. March 27, 2 | 2007-03-27 |
Via in semiconductor device
App 20070035026 - Su; Yi-Nien ; et al. | 2007-02-15 |
Dual damascene interconnect in hybrid dielectric
App 20070001306 - Su; Yi-Nien ; et al. | 2007-01-04 |
Air gap interconnect structure and method thereof
App 20060264027 - Su; Yi-Nien ; et al. | 2006-11-23 |
Measuring low dielectric constant film properties during processing
App 20060220653 - Tsai; Jang-Shiang ; et al. | 2006-10-05 |
Air gap interconnect structure and method thereof
Grant 7,094,689 - Su , et al. August 22, 2 | 2006-08-22 |
Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof
App 20060160362 - Huang; Yi-Chen ; et al. | 2006-07-20 |
Contact hole structures and contact structures and fabrication methods thereof
App 20060154478 - Hsu; Ju-Wang ; et al. | 2006-07-13 |
Forming a dual damascene structure without ashing-damaged ultra-low-k intermetal dielectric
App 20060115981 - Shieh; Jyu-Horng ; et al. | 2006-06-01 |
Low oxygen content photoresist stripping process for low dielectric constant materials
Grant 7,029,992 - Shieh , et al. April 18, 2 | 2006-04-18 |
Method for photoresist stripping and treatment of low-k dielectric material
App 20060063386 - Tsai; Jang-Shiang ; et al. | 2006-03-23 |
Dual damascene structure formed of low-k dielectric materials
Grant 7,015,133 - Su , et al. March 21, 2 | 2006-03-21 |
Low Oxygen Content Photoresist Stripping Process For Low Dielectric Constant Materials
App 20060040474 - Shieh; Jyu-Horng ; et al. | 2006-02-23 |
Method of making dual damascene with via etch through
App 20060030159 - Su; Yi-Nien ; et al. | 2006-02-09 |
Air gap interconnect structure and method thereof
App 20060019482 - Su; Yi-Nien ; et al. | 2006-01-26 |
Dual Damascene Structure Formed Of Low-k Dielectric Materials
App 20050233572 - Su, Yi-Nien ; et al. | 2005-10-20 |
Method for improved plasma etching control
Grant 6,828,251 - Su , et al. December 7, 2 | 2004-12-07 |
Dry-wet-dry solvent-free process after stop layer etch in dual damascene process
Grant 6,797,627 - Shih , et al. September 28, 2 | 2004-09-28 |
Method for improved plasma etching control
App 20030155329 - Su, Yi-Nien ; et al. | 2003-08-21 |
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