Su; Wei-Shuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Su; Wei-Shuo.The latest application filed is for "method of manufacturing photo masks".

Company Profile

2.8.13

Su; Wei-Shuo - Hsinchu TW
SU; Wei-Shuo - Hsinchu City TW
Su; Wei-Shuo - Taoyuan TW
SU; WEI-SHUO - New Taipei TW
Su; Wei-Shuo - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Signal line patterning for standard cells Grant 11,201,064 - Hsiao , et al. December 14, 2	2021-12-14
Method Of Manufacturing Photo Masks App 20210356872 - HSIEH; Ken-Hsien ; et al.	2021-11-18
Method of manufacturing photo masks Grant 11,079,685 - Hsieh , et al. August 3, 2	2021-08-03
Tunable Illuminator For Lithography Systems App 20210132504 - HSIEH; Ken-Hsien ; et al.	2021-05-06
Signal Line Patterning For Standard Cells App 20210066091 - HSIAO; Chih-Min ; et al.	2021-03-04
Method Of Manufacturing Photo Masks App 20190146333 - HSIEH; Ken-Hsien ; et al.	2019-05-16
Package structure Grant 9,905,508 - Su February 27, 2	2018-02-27
Package Structure App 20170365540 - SU; WEI-SHUO	2017-12-21
Printed Circuit Board App 20170367191 - SU; WEI-SHUO	2017-12-21
Method for manufacturing package structure Grant 9,786,589 - Su October 10, 2	2017-10-10
Method for manufacturing printed circuit board with etching process to partially remove conductive layer Grant 9,788,437 - Su October 10, 2	2017-10-10
Chip Package And Method For Manufacturing Same App 20170110427 - SU; WEI-SHUO	2017-04-20
Printed Circuit Board And Method For Manufacturing Same App 20160353582 - SU; WEI-SHUO	2016-12-01
Packaging substrate and method for manufacturing same Grant 9,472,426 - Su October 18, 2	2016-10-18
Package Structure And Method For Manufacturing Same App 20160181181 - SU; WEI-SHUO	2016-06-23
Packaging Substrate And Method For Manufacturing Same App 20150371873 - SU; WEI-SHUO	2015-12-24
Substrate, chip package and method for manufacturing substrate Grant 9,190,386 - Su November 17, 2	2015-11-17
Packaging substrate and method for manufacturing same Grant 9,159,614 - Su October 13, 2	2015-10-13
Substrate, Chip Package And Method For Manufacturing Substrate App 20150024552 - SU; WEI-SHUO	2015-01-22
Multilayer Printed Circuit Board Having Anisotropy Condictive Film And Method For Manufacturing Same App 20150000959 - SU; WEI-SHUO	2015-01-01
Packaging Substrate And Method For Manufacturing Same App 20140361439 - SU; WEI-SHUO	2014-12-11

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