SU; Teh-Tien

Patent Applications and Registrations

Patent applications and USPTO patent grants for SU; Teh-Tien.The latest application filed is for "atomic layer etching of tungsten for enhanced tungsten deposition fill".

Company Profile

2.4.10

SU; Teh-Tien - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20220115244 - LAI; Chiukin Steven ; et al.	2022-04-14
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20210305059 - Lai; Chiukin Steven ; et al.	2021-09-30
Atomic layer etch of tungsten for enhanced tungsten deposition fill Grant 11,069,535 - Lai , et al. July 20, 2	2021-07-20
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill App 20200286743 - Lai; Chiukin Steven ; et al.	2020-09-10
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill App 20180240682 - Lai; Chiukin Steven ; et al.	2018-08-23
Atomic layer etching of tungsten for enhanced tungsten deposition fill Grant 9,972,504 - Lai , et al. May 15, 2	2018-05-15
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill App 20170040214 - Lai; Chiukin Steven ; et al.	2017-02-09
Method Of Performing An In Situ Chamber Clean App 20120094499 - Ng; Siu Tang ; et al.	2012-04-19
Removal of process residues on the backside of a substrate Grant 8,083,963 - Delgadino , et al. December 27, 2	2011-12-27
Methods Of Processing Substrates Having Metal Materials App 20110306215 - DING; GUOWEN ; et al.	2011-12-15
Methods For Adjusting Critical Dimension Uniformity In An Etch Process With A Highly Concentrated Unsaturated Hydrocarbon Gas App 20100003828 - Ding; Guowen ; et al.	2010-01-07
Removal Of Process Residues On The Backside Of A Substrate App 20080194111 - Delgadino; Gerardo A. ; et al.	2008-08-14
Plasma Dielectric Etch Process Including Ex-situ Backside Polymer Removal For Low-dielectric Constant Material App 20070238305 - Delgadino; Gerardo A. ; et al.	2007-10-11
Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material Grant 7,276,447 - Delgadino , et al. October 2, 2	2007-10-02

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