SU; SZU-HSIANG

Patent Applications and Registrations

Patent applications and USPTO patent grants for SU; SZU-HSIANG.The latest application filed is for "polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite film".

Company Profile

8.4.18

SU; SZU-HSIANG - Taoyuan TW
SU; SZU-HSIANG - New Taipei TW
SU; Szu-Hsiang - Tainan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transparent Polyimide Mixture, Method For Manufacturing The Transparent Polyimide Mixture, And Method For Manufacturing Transparent Polyimide Film App 20220169851 - LEE; KUAN-WEI ; et al.	2022-06-02
Polymer Dispersion, Method For Manufacturing The Polymer Dispersion, And Method For Manufacturing Polymer Composite Film App 20220169789 - LEE; KUAN-WEI ; et al.	2022-06-02
Thick Polyimide Film And Method For Manufacturing Same App 20220152912 - HUANG; WEI-HSIN ; et al.	2022-05-19
Polyimide Film And Method For Manufacturing Same App 20220135797 - HUANG; WEI-HSIN ; et al.	2022-05-05
Circuit board using low dielectric resin composition Grant 11,261,328 - Su , et al. March 1, 2	2022-03-01
Fluorine-containing Dispersion And Method Of Manufacturing The Same, And Fluorine-containing Composite Film App 20220033663 - LEE; KUAN-WEI ; et al.	2022-02-03
Polyimide Component, Polyimide Film, And Polyimide Copper Clad Laminate App 20220002490 - LEE; KUAN-WEI ; et al.	2022-01-06
Liquid Crystal Polymer Composition, Copper Substrate, And Method For Manufacturing The Copper Substrate App 20210363384 - LEE; KUAN-WEI ; et al.	2021-11-25
Circuit Board Using Low Dielectric Resin Composition App 20210102067 - SU; SZU-HSIANG ; et al.	2021-04-08
Polyimide Film, Block Copolymer Of Polyamide Acid, And Method For Manufacturing The Block Copolymer Of Polyamide Acid App 20210087319 - LEE; KUAN-WEI ; et al.	2021-03-25
Photosensitive resin composition, and polymer film made therefrom Grant 10,928,730 - Yen , et al. February 23, 2	2021-02-23
Polyamic Acid Composition, Polyimide Film, And Copper Clad Laminate App 20210017336 - SU; SZU-HSIANG ; et al.	2021-01-21
Low dielectric resin composition, film and circuit board using the same Grant 10,894,882 - Su , et al. January 19, 2	2021-01-19
Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same Grant 10,844,174 - Huang , et al. November 24, 2	2020-11-24
Photosensitive Resin Composition, And Polymer Film Made Therefrom App 20190361349 - YEN; CHEN-FENG ; et al.	2019-11-28
Low Dielectric Polyimide Composition, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same App 20190085131 - HUANG; NAN-KUN ; et al.	2019-03-21
Low Dielectric Resin Composition, Film And Circuit Board Using The Same App 20180265699 - SU; SZU-HSIANG ; et al.	2018-09-20
Resin Composition, Method For Making Resin Composition And Film For Circuit Board, And Circuit Board App 20180223048 - HSU; MAO-FENG ; et al.	2018-08-09
Resin Composition, Adhesive Film, And Circuit Board Using The Same App 20170369747 - SU; SZU-HSIANG ; et al.	2017-12-28
Polyamic Acid, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same App 20170369653 - KAO; YU-WEN ; et al.	2017-12-28
Circuit Board And Method For Making The Same App 20170079136 - SU; SZU-HSIANG ; et al.	2017-03-16
Polyimide Shield And Integrated Circuit Structure Having The Same App 20100252940 - HUANG; Tang-Chieh ; et al.	2010-10-07

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