Su; Michael Z.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Su; Michael Z..The latest application filed is for "interposer with beyond reticle field conductor pads".
Company Profile
4.39.37
- Su; Michael Z. - Round Rock TX US
- Su; Michael Z. - Austin TX
- - Round Rock TX US
- Su; Michael Z. - Round Road TX
Patent Activity
| Patent | Date |
|---|---|
| Interposer with identification system Grant 10,290,606 - Alfano , et al. | 2019-05-14 |
| Interposer with beyond reticle field conductor pads Grant 9,806,014 - Alfano , et al. October 31, 2 | 2017-10-31 |
| Semiconductor workpiece with selective backside metallization Grant 9,793,239 - Su , et al. October 17, 2 | 2017-10-17 |
| Interposer With Beyond Reticle Field Conductor Pads App 20170213787 - Alfano; Michael S. ; et al. | 2017-07-27 |
| Semiconductor chip with thermal interface tape Grant 9,627,281 - Prejean , et al. April 18, 2 | 2017-04-18 |
| Semiconductor Workpiece With Selective Backside Metallization App 20170092616 - Su; Michael Z. ; et al. | 2017-03-30 |
| Semiconductor Chip With Redundant Thru-silicon-vias App 20160365335 - Black; Bryan ; et al. | 2016-12-15 |
| Semiconductor chip with redundant thru-silicon-vias Grant 9,437,561 - Black , et al. September 6, 2 | 2016-09-06 |
| Stacked semiconductor chips with thermal management Grant 9,385,055 - Refai-Ahmed , et al. July 5, 2 | 2016-07-05 |
| Semiconductor chip device with polymeric filler trench Grant 8,866,276 - Su , et al. October 21, 2 | 2014-10-21 |
| Stacked semiconductor chip device with thermal management circuit board Grant 8,796,842 - Refai-Ahmed , et al. August 5, 2 | 2014-08-05 |
| Semiconductor chip device with solder diffusion protection Grant 8,759,962 - Su June 24, 2 | 2014-06-24 |
| Power cycling test arrangement Grant 8,749,254 - Su June 10, 2 | 2014-06-10 |
| Semiconductor Chip Device With Polymeric Filler Trench App 20140103506 - Su; Michael Z. ; et al. | 2014-04-17 |
| Semiconductor chip device with underfill Grant 8,691,626 - Su , et al. April 8, 2 | 2014-04-08 |
| Method of fabricating a semiconductor chip with supportive terminal pad Grant 8,647,974 - Topacio , et al. February 11, 2 | 2014-02-11 |
| Integrated circuit package having offset vias Grant 8,624,404 - Su , et al. January 7, 2 | 2014-01-07 |
| Semiconductor chip device with polymeric filler trench Grant 08617926 - | 2013-12-31 |
| Semiconductor chip device with polymeric filler trench Grant 8,617,926 - Su , et al. December 31, 2 | 2013-12-31 |
| Integrated Circuit Package Having Offset Vias App 20130341802 - Su; Michael Z. ; et al. | 2013-12-26 |
| Interposer With Identification System App 20130341783 - Alfano; Michael ; et al. | 2013-12-26 |
| Semiconductor Substrate With Onboard Test Structure App 20130342231 - Alfano; Michael ; et al. | 2013-12-26 |
| Semiconductor chip device with liquid thermal interface material Grant 8,574,965 - Refai-Ahmed , et al. November 5, 2 | 2013-11-05 |
| Semiconductor Chip With Offset Pads App 20130161814 - Su; Michael Z. ; et al. | 2013-06-27 |
| Stacked semiconductor chip device with thermal management Grant 8,472,190 - Refai-Ahmed , et al. June 25, 2 | 2013-06-25 |
| Heat Spreader For Multiple Chip Systems App 20130147028 - Su; Michael Z. ; et al. | 2013-06-13 |
| Method of manufacturing and assembling semiconductor chips with offset pads Grant 8,394,672 - Su , et al. March 12, 2 | 2013-03-12 |
| Semiconductor Chip Device With Solder Diffusion Protection App 20130049229 - Su; Michael Z. | 2013-02-28 |
| Semiconductor chip with reinforcing through-silicon-vias Grant 8,338,961 - Su , et al. December 25, 2 | 2012-12-25 |
| Semiconductor chip device with solder diffusion protection Grant 8,299,633 - Su October 30, 2 | 2012-10-30 |
| Semiconductor chip with protective scribe structure Grant 8,293,581 - Su , et al. October 23, 2 | 2012-10-23 |
| Semiconductor Chip With Supportive Terminal Pad App 20120241985 - Topacio; Roden R. ; et al. | 2012-09-27 |
| Semiconductor Chip With Reinforcing Through-silicon-vias App 20120205791 - Su; Michael Z. ; et al. | 2012-08-16 |
| Semiconductor chip with reinforcing through-silicon-vias Grant 8,193,039 - Su , et al. June 5, 2 | 2012-06-05 |
| Power Cycling Test Arrangement App 20120119767 - SU; Michael Z. | 2012-05-17 |
| Semiconductor Chip Device With Liquid Thermal Interface Material App 20120098119 - Refai-Ahmed; Gamal ; et al. | 2012-04-26 |
| Stacked Semiconductor Chip Device With Thermal Management App 20120075807 - Refai-Ahmed; Gamal ; et al. | 2012-03-29 |
| Semiconductor Chip With Reinforcing Through-silicon-vias App 20120074579 - Su; Michael Z. ; et al. | 2012-03-29 |
| Semiconductor Chip Device With Underfill App 20120061853 - Su; Michael Z. ; et al. | 2012-03-15 |
| Semiconductor Chip With Redundant Thru-silicon-vias App 20120061821 - Black; Bryan ; et al. | 2012-03-15 |
| Semiconductor Chip Device With Polymeric Filler Trench App 20120061852 - Su; Michael Z. ; et al. | 2012-03-15 |
| Semiconductor Chip With Thermal Interface Tape App 20120043539 - Prejean; Seth ; et al. | 2012-02-23 |
| Stacked Semiconductor Chips With Thermal Management App 20120043668 - Refai-Ahmed; Gamal ; et al. | 2012-02-23 |
| Stacked Semiconductor Chip Device With Thermal Management Circuit Board App 20120043669 - Refai-Ahmed; Gamal ; et al. | 2012-02-23 |
| Semiconductor Chip With Offset Pads App 20120038061 - Su; Michael Z. ; et al. | 2012-02-16 |
| Semiconductor Chip Device with Solder Diffusion Protection App 20110147916 - Su; Michael Z. | 2011-06-23 |
| Semiconductor Chip with Protective Scribe Structure App 20100207250 - Su; Michael Z. ; et al. | 2010-08-19 |
| Semiconductor chip with crack stop Grant 7,679,200 - Su , et al. March 16, 2 | 2010-03-16 |
| Semiconductor Chip with Crack Stop App 20090065952 - Su; Michael Z. ; et al. | 2009-03-12 |
| Electrical Insulating Layer for Metallic Thermal Interface Material App 20080124840 - Su; Michael Z. | 2008-05-29 |
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