Su; Li-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Su; Li-Lin.The latest application filed is for "integrated circuit interconnect structures with air gaps".

Company Profile

6.19.20

Su; Li-Lin - Taichung County TW
Su; Li-Lin - Dongshih TW
Su; Li-Lin - Taichung TW
SU; Li-Lin - Taichung City TW
Su; Li-Lin - Dongshih Township Taichung County TW
Su, Li-Lin - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-metal fill with self-aligned patterning and dielectric with voids Grant 11,422,475 - Yang , et al. August 23, 2	2022-08-23
Integrated Circuit Interconnect Structures with Air Gaps App 20220157720 - Yang; Tai-I ; et al.	2022-05-19
Copper contact plugs with barrier layers Grant 11,251,131 - Su , et al. February 15, 2	2022-02-15
Integrated circuit interconnect structures with air gaps Grant 11,244,898 - Yang , et al. February 8, 2	2022-02-08
Semiconductor device and manufacturing method thereof Grant 11,127,680 - Fu , et al. September 21, 2	2021-09-21
Structure and formation method of interconnection structure of semiconductor device Grant 11,088,020 - Yang , et al. August 10, 2	2021-08-10
Copper Contact Plugs with Barrier Layers App 20200321279 - Su; Li-Lin ; et al.	2020-10-08
Copper contact plugs with barrier layers Grant 10,700,010 - Su , et al.	2020-06-30
Multi-metal Fill With Self-aligned Patterning And Dielectric With Voids App 20200124985 - Yang; Tai-I ; et al.	2020-04-23
Multi-metal fill with self-aligned patterning and dielectric with voids Grant 10,534,273 - Yang , et al. Ja	2020-01-14
Integrated Circuit Interconnect Structures with Air Gaps App 20200006228 - Yang; Tai-I ; et al.	2020-01-02
Structure And Formation Method Of Interconnection Structure Of Semiconductor Device App 20190067089 - YANG; Tai-I ; et al.	2019-02-28
Multi-metal Fill With Self-aligned Patterning And Dielectric With Voids App 20180164698 - YANG; Tai-I ; et al.	2018-06-14
Trench liner for removing impurities in a non-copper trench Grant 9,935,006 - Wu , et al. April 3, 2	2018-04-03
Semiconductor Device And Manufacturing Method Thereof App 20170287842 - FU; Shih-Kang ; et al.	2017-10-05
Semiconductor device and manufacturing method thereof Grant 9,721,894 - Fu , et al. August 1, 2	2017-08-01
Copper Contact Plugs with Barrier Layers App 20170207167 - Su; Li-Lin ; et al.	2017-07-20
Trench Liner For Removing Impurities In A Non-copper Trench App 20170178957 - Wu; Hsien-Chang ; et al.	2017-06-22
Copper contact plugs with barrier layers Grant 9,614,052 - Su , et al. April 4, 2	2017-04-04
Semiconductor Device And Manufacturing Method Thereof App 20170092591 - FU; Shih-Kang ; et al.	2017-03-30
Trench liner for removing impurities in a non-copper trench Grant 9,589,897 - Wu , et al. March 7, 2	2017-03-07
Trench Liner For Removing Impurities In A Non-copper Trench App 20170053876 - Wu; Hsien-Chang ; et al.	2017-02-23
Semiconductor device and manufacturing method thereof Grant 9,530,737 - Fu , et al. December 27, 2	2016-12-27
Copper Contact Plugs with Barrier Layers App 20160064517 - Su; Li-Lin ; et al.	2016-03-03
Copper contact plugs with barrier layers Grant 9,136,206 - Su , et al. September 15, 2	2015-09-15
Copper Contact Plugs with Barrier Layers App 20140027822 - Su; Li-Lin ; et al.	2014-01-30
In situ Cu seed layer formation for improving sidewall coverage Grant 8,252,690 - Su , et al. August 28, 2	2012-08-28
Method for forming composite barrier layer Grant 8,034,709 - Huang , et al. October 11, 2	2011-10-11
Multi-step Cu seed layer formation for improving sidewall coverage Grant 7,704,886 - Su , et al. April 27, 2	2010-04-27
Multi-Step Cu Seed Layer Formation for Improving Sidewall Coverage App 20090209098 - Su; Li-Lin ; et al.	2009-08-20
In Situ Cu Seed Layer Formation for Improving Sidewall Coverage App 20090209106 - Su; Li-Lin ; et al.	2009-08-20
Method for forming composite barrier layer App 20090047780 - Huang; Cheng-Lin ; et al.	2009-02-19
Composite barrier layer Grant 7,453,149 - Huang , et al. November 18, 2	2008-11-18
High performance metallization cap layer Grant 7,253,501 - Lee , et al. August 7, 2	2007-08-07
High performance metallization cap layer App 20060027922 - Lee; Hsien-Ming ; et al.	2006-02-09
Composite barrier layer App 20060027925 - Huang; Cheng-Lin ; et al.	2006-02-09
Pre-clean chamber with wafer heating apparatus and method of use App 20050189075 - Pan, Shing-Chyang ; et al.	2005-09-01

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