| Patent | Date |
|---|
Semiconductor Device Structure With Serpentine Conductive Feature And Method For Forming The Same
App 20220293519 - SU; Kuo-Hui | 2022-09-15 |
Semiconductor memory device with air gaps for reducing capacitive coupling and method for preparing the same
Grant 11,444,087 - Su September 13, 2 | 2022-09-13 |
Method for preparing semiconductor device with air gap structure
Grant 11,417,667 - Su August 16, 2 | 2022-08-16 |
Semiconductor device with slanted conductive layers and method for fabricating the same
Grant 11,398,441 - Su July 26, 2 | 2022-07-26 |
Semiconductor device with reduced critical dimensions and method of manufacturing the same
Grant 11,355,342 - Su June 7, 2 | 2022-06-07 |
Method For Preparing Semiconductor Device Structure With Manganese-containing Linling Layer
App 20220173041 - SU; KUO-HUI | 2022-06-02 |
Semiconductor Device Structure With Manganese-containing Lining Layer And Method For Preparing The Same
App 20220148970 - SU; Kuo-Hui | 2022-05-12 |
Semiconductor device with metal spacers and method for fabricating the same
Grant 11,309,245 - Su April 19, 2 | 2022-04-19 |
Method For Preparing Semiconductor Memory Device With Air Gaps For Reducing Capacitive Coupling
App 20220102355 - SU; KUO-HUI | 2022-03-31 |
Method For Fabricating Semiconductor Device With Slanted Conductive Layers
App 20220093545 - SU; KUO-HUI | 2022-03-24 |
Semiconductor Device With Slanted Conductive Layers And Method For Fabricating The Same
App 20220084967 - SU; Kuo-Hui | 2022-03-17 |
Method For Fabricating Semiconductor Device With Metal Spacers
App 20220084933 - SU; KUO-HUI | 2022-03-17 |
Semiconductor Device With Reduced Critical Dimensions
App 20220044933 - SU; KUO-HUI | 2022-02-10 |
Semiconductor Memory Device With Air Gaps For Reducing Capacitive Coupling And Method For Preparing The Same
App 20210335792 - SU; Kuo-Hui | 2021-10-28 |
Semiconductor device with nanowire plugs and method for fabricating the same
Grant 11,107,809 - Su August 31, 2 | 2021-08-31 |
Method For Preparing Semiconductor Device With Air Gap Structure
App 20210151441 - SU; Kuo-Hui | 2021-05-20 |
Semiconductor Device And Method For Fabricating The Same
App 20210125915 - SU; Kuo-Hui | 2021-04-29 |
Semiconductor package and method for preparing the same
Grant 10,985,151 - Su April 20, 2 | 2021-04-20 |
Semiconductor device with bit lines at different levels and method for fabricating the same
Grant 10,978,459 - Su April 13, 2 | 2021-04-13 |
Semiconductor Device With Nanowire Plugs And Method For Fabricating The Same
App 20210091073 - SU; Kuo-Hui | 2021-03-25 |
Semiconductor Device With Bit Lines At Different Levels And Method For Fabricating The Same
App 20210074707 - SU; Kuo-Hui | 2021-03-11 |
Semiconductor device with air gap structure and method for preparing the same
Grant 10,937,790 - Su March 2, 2 | 2021-03-02 |
Semiconductor Device With Air Gap Structure And Method For Preparing The Same
App 20210050355 - SU; Kuo-Hui | 2021-02-18 |
Semiconductor Device With Reduced Critical Dimensions And Method Of Manufacturing The Same
App 20200395214 - SU; KUO-HUI | 2020-12-17 |
Method for preparing conductive via
Grant 10,840,136 - Su November 17, 2 | 2020-11-17 |
Semiconductor Packages With Adhesion Enhancement Layers
App 20200357766 - SU; Kuo-Hui | 2020-11-12 |
Semiconductor Package And Method For Preparing The Same
App 20200335486 - SU; KUO-HUI | 2020-10-22 |
Method For Preparing Multiplayer Structure
App 20200203157 - SU; KUO-HUI | 2020-06-25 |
Semiconductor device and manufacturing method thereof
Grant 10,651,157 - Su | 2020-05-12 |
Low contact resistance thin film transistor
Grant 9,647,133 - Pham , et al. May 9, 2 | 2017-05-09 |
Low Contact Resistance Thin Film Transistor
App 20160284853 - PHAM; Duy Vu ; et al. | 2016-09-29 |
Semiconductor device having vertical gates and fabrication thereof
Grant 9,059,142 - Liang , et al. June 16, 2 | 2015-06-16 |
Semiconductor device and method of manufacturing the same
Grant 8,815,735 - Chen , et al. August 26, 2 | 2014-08-26 |
Fabricating method of transistor
Grant 8,772,119 - Su , et al. July 8, 2 | 2014-07-08 |
Through-silicon via with a non-continuous dielectric layer
Grant 8,754,531 - Chiu , et al. June 17, 2 | 2014-06-17 |
Semiconductor Device Having Vertical Gates And Fabrication Thereof
App 20140021535 - Liang; Wen-Ping ; et al. | 2014-01-23 |
Copper Interconnect Structure And Method For Fabricating Thereof
App 20140001633 - Huang; Chi-Wen ; et al. | 2014-01-02 |
Through-silicon Via And Fabrication Method Thereof
App 20130328202 - Huang; Chi-Wen ; et al. | 2013-12-12 |
Through-silicon via and fabrication method thereof
Grant 8,587,131 - Huang , et al. November 19, 2 | 2013-11-19 |
Semiconductor Device And Method Of Manufacturing The Same
App 20130292799 - CHEN; Yi Jung ; et al. | 2013-11-07 |
Through-silicon Via And Fabrication Method Thereof
App 20130241063 - Chiu; Yu-Shan ; et al. | 2013-09-19 |
Method of forming conductive pattern
Grant 8,536,056 - Su , et al. September 17, 2 | 2013-09-17 |
Buried Word Line And Method For Forming Buried Word Line In Semiconductor Device
App 20130140682 - Huang; Chi-Wen ; et al. | 2013-06-06 |
Method for fabricating a gate dielectric layer and for fabricating a gate structure
Grant 8,420,477 - Su , et al. April 16, 2 | 2013-04-16 |
Capacitor and manufacturing method thereof
Grant 8,410,535 - Su , et al. April 2, 2 | 2013-04-02 |
Fabricating Method Of Transistor
App 20130071978 - Su; Kuo-Hui ; et al. | 2013-03-21 |
Semiconductor Process
App 20130071992 - Su; Kuo-Hui ; et al. | 2013-03-21 |
Method Of Forming Conductive Pattern
App 20130052820 - Su; Kuo-Hui ; et al. | 2013-02-28 |
Methods For Fabricating A Gate Dielectric Layer And For Fabricating A Gate Structure
App 20120276730 - Su; Kuo Hui ; et al. | 2012-11-01 |
Integrated Circuit Structure Including Copper-aluminum Interconnect And Method For Fabricating The Same
App 20120273950 - Su; Kuo Hui ; et al. | 2012-11-01 |
Method For Fabricating A Gate Dielectric Layer And For Fabricating A Gate Structure
App 20120276731 - Su; Kuo Hui ; et al. | 2012-11-01 |
Integrated Circuit Structure Including A Copper-aluminum Interconnect And Method For Fabricating The Same
App 20120273948 - Su; Kuo Hui ; et al. | 2012-11-01 |
Manufacturing Method Of Gate Dielectric Layer
App 20120270408 - Su; Kuo-Hui ; et al. | 2012-10-25 |
Capacitor And Manufacturing Method Thereof
App 20120267760 - Su; Kuo-Hui ; et al. | 2012-10-25 |
Manufacturing Method Of Gate Dielectric Layer
App 20120270411 - Su; Kuo-Hui ; et al. | 2012-10-25 |
Seminconductor Device And Fabrications Thereof
App 20120056265 - Liang; Wen-Ping ; et al. | 2012-03-08 |
Semiconductor structure and method for making the same
Grant 8,003,528 - Lo , et al. August 23, 2 | 2011-08-23 |
Interconnection Structure Of Semiconductor Integrated Circuit And Method For Making The Same
App 20100314765 - Liang; Wen-Ping ; et al. | 2010-12-16 |
Semiconductor Structure With Selectively Deposited Tungsten Film And Method For Making The Same
App 20100276764 - Lo; Yi-Jen ; et al. | 2010-11-04 |
Semiconductor Structure And Method For Making The Same
App 20100279498 - Lo; Yi-Jen ; et al. | 2010-11-04 |
Method For Fabricating A Semiconductor Device
App 20090017604 - WANG; Mao-Ying ; et al. | 2009-01-15 |
Method For Measuring A Thin Film Thickness
App 20080268557 - LIANG; Wen-Ping ; et al. | 2008-10-30 |
Method for fabricating semiconductor device having stacked-gate structure
Grant 7,375,017 - Ho , et al. May 20, 2 | 2008-05-20 |
Method for fabricating semiconductor device having stacked-gate structure
App 20060134913 - Ho; Tzu-En ; et al. | 2006-06-22 |
Method for fabricating semiconductor device having stacked-gate structure
Grant 7,022,603 - Ho , et al. April 4, 2 | 2006-04-04 |
Method for fabricating semiconductor device having stacked-gate structure
App 20050020044 - Ho, Tzu-En ; et al. | 2005-01-27 |
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