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SU; Jun-Liang Patent Filings

SU; Jun-Liang

Patent Applications and Registrations

Patent applications and USPTO patent grants for SU; Jun-Liang.The latest application filed is for "methods and apparatus for warpage correction".

Company Profile
4.4.7
  • SU; Jun-Liang - SINGAPORE SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods And Apparatus For Warpage Correction
App 20220085268 - THIRUNAVUKARASU; Sriskantharajah ;   et al.
2022-03-17
Methods and apparatus for processing a substrate
Grant 11,177,146 - Peng , et al. November 16, 2
2021-11-16
Methods And Apparatus For Processing A Substrate
App 20210134627 - Peng; Qi Jie ;   et al.
2021-05-06
Methods And Apparatus For Contactless Substrate Warpage Correction
App 20210057238 - TAN; CHIN WEI ;   et al.
2021-02-25
Methods And Apparatus For Substrate Warpage Correction
App 20210035795 - PENG; Qi Jie ;   et al.
2021-02-04
Next generation warpage measurement system
Grant 10,446,423 - Su , et al. Oc
2019-10-15
Methods and apparatus for correcting substrate deformity
Grant 10,325,790 - Peh , et al.
2019-06-18
Methods And Apparatus For Correcting Substrate Deformity
App 20180218928 - PEH; Eng Sheng ;   et al.
2018-08-02
Next Generation Warpage Measurement System
App 20180144960 - SU; JUN-LIANG ;   et al.
2018-05-24
Methods and apparatus for correcting substrate deformity
Grant 9,818,624 - Lew , et al. November 14, 2
2017-11-14
Methods And Apparatus For Correcting Substrate Deformity
App 20160322234 - LEW; Jen Sern ;   et al.
2016-11-03

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