loadpatents
Patent applications and USPTO patent grants for SU; Jun-Liang.The latest application filed is for "methods and apparatus for warpage correction".
Patent | Date |
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Methods And Apparatus For Warpage Correction App 20220085268 - THIRUNAVUKARASU; Sriskantharajah ;   et al. | 2022-03-17 |
Methods and apparatus for processing a substrate Grant 11,177,146 - Peng , et al. November 16, 2 | 2021-11-16 |
Methods And Apparatus For Processing A Substrate App 20210134627 - Peng; Qi Jie ;   et al. | 2021-05-06 |
Methods And Apparatus For Contactless Substrate Warpage Correction App 20210057238 - TAN; CHIN WEI ;   et al. | 2021-02-25 |
Methods And Apparatus For Substrate Warpage Correction App 20210035795 - PENG; Qi Jie ;   et al. | 2021-02-04 |
Next generation warpage measurement system Grant 10,446,423 - Su , et al. Oc | 2019-10-15 |
Methods and apparatus for correcting substrate deformity Grant 10,325,790 - Peh , et al. | 2019-06-18 |
Methods And Apparatus For Correcting Substrate Deformity App 20180218928 - PEH; Eng Sheng ;   et al. | 2018-08-02 |
Next Generation Warpage Measurement System App 20180144960 - SU; JUN-LIANG ;   et al. | 2018-05-24 |
Methods and apparatus for correcting substrate deformity Grant 9,818,624 - Lew , et al. November 14, 2 | 2017-11-14 |
Methods And Apparatus For Correcting Substrate Deformity App 20160322234 - LEW; Jen Sern ;   et al. | 2016-11-03 |
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