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Patent applications and USPTO patent grants for Su; Jiale.The latest application filed is for "method of forming cavity based on deep trench erosion".
Patent | Date |
---|---|
Photolithography method and system based on high step slope Grant 10,816,903 - Su October 27, 2 | 2020-10-27 |
Method Of Forming Cavity Based On Deep Trench Erosion App 20200243342 - SU; Jiale ;   et al. | 2020-07-30 |
Photolithography Method And System Based On High Step Slope App 20180188652 - SU; Jiale | 2018-07-05 |
Photolithography method and system based on high step slope Grant 9,939,724 - Su April 10, 2 | 2018-04-10 |
Silicon etching method Grant 9,371,224 - Su June 21, 2 | 2016-06-21 |
Photolithography Method And System Based On High Step Slope App 20150227048 - Su; Jiale | 2015-08-13 |
Silicon Etching Method App 20150140823 - Su; Jiale | 2015-05-21 |
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