SU; Jheng-Si
Patent Applications and Registrations
Patent applications and USPTO patent grants for SU; Jheng-Si.The latest application filed is for "chemical mechanical polishing method".
- SU; Jheng-Si - Zhubei City TW
- Su; Jheng-Si - Zhubei TW
- SU; Jheng-Si - Hsinchu TW
| Patent | Date |
|---|---|
| Chemical Mechanical Polishing Method App 20220219285 - WEI; Yu-Chen ; et al. | 2022-07-14 |
| Chemical mechanical polishing apparatus and method Grant 11,292,101 - Wei , et al. April 5, 2 | 2022-04-05 |
| Cmp Safe Alignment Mark App 20220102285 - HSU; Huang-Jen ; et al. | 2022-03-31 |
| Article transporter in semiconductor fabrication Grant 11,251,063 - Su , et al. February 15, 2 | 2022-02-15 |
| Polishing process for forming semiconductor device structure Grant 11,094,554 - Lin , et al. August 17, 2 | 2021-08-17 |
| Article Transporter In Semiconductor Fabrication App 20210028049 - SU; Jheng-Si ; et al. | 2021-01-28 |
| Article transferring method in semiconductor fabrication Grant 10,804,133 - Su , et al. October 13, 2 | 2020-10-13 |
| Article Transferring Method In Semiconductor Fabrication App 20190157129 - SU; Jheng-Si ; et al. | 2019-05-23 |
| Chemical Mechanical Polishing Apparatus And Method App 20190152016 - WEI; Yu-Chen ; et al. | 2019-05-23 |
| Polishing Process For Forming Semiconductor Device Structure App 20180286699 - LIN; Shih-Ho ; et al. | 2018-10-04 |
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