Su; Huan-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Su; Huan-Ping.The latest application filed is for "remote controller and paring method thereof".

Company Profile

3.8.12

Su; Huan-Ping - Hsinchu TW
SU; Huan-Ping - Hsinchu City TW
Su; Huan-Ping - Hsin-Chu TW
Su; Huan-Ping - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Remote controller and paring method thereof Grant 10,492,238 - Su , et al. Nov	2019-11-26
Remote Controller And Paring Method Thereof App 20190281642 - SU; Huan-Ping ; et al.	2019-09-12
Broadcasting Communication System, Broadcasting Relay Device And Broadcasting Relay Method App 20190068305 - SU; Huan-Ping	2019-02-28
Data Security Transmission Wirelessly with Zigbee Chips App 20100272261 - Su; Chih-Yuan ; et al.	2010-10-28
ISM-band printed antenna for a portion of a circuit board Grant D570,800 - Chen , et al. June 10, 2	2008-06-10
Semiconductor package with heat sink Grant 6,956,741 - Su October 18, 2	2005-10-18
Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package Grant 6,933,178 - Su August 23, 2	2005-08-23
Encapsulated semiconductor package free of chip carrier Grant 6,897,566 - Su May 24, 2	2005-05-24
Test fixture for semiconductor package and test method of using the same Grant 6,859,056 - Bai , et al. February 22, 2	2005-02-22
Semiconductor package with heat sink App 20040184240 - Su, Huan-Ping	2004-09-23
Stacked flip-chip package App 20040070083 - Su, Huan-Ping	2004-04-15
Semiconductor package and method for fabricating the same Grant 6,709,894 - Tsai , et al. March 23, 2	2004-03-23
Semiconductor package with reinforced substrate and fabrication method of the substrate App 20040004277 - Tsai, Chung-Che ; et al.	2004-01-08
Semiconductor package and method for fabricating the same App 20030234442 - Su, Huan-Ping	2003-12-25
Test fixture for semiconductor packages App 20030197269 - Su, Huan-Ping ; et al.	2003-10-23
Test fixture for semiconductor packages and test method of using the same App 20030190826 - Su, Huan-Ping ; et al.	2003-10-09
Test method and test device for integrated circuits App 20030155907 - Hsu, Johnson ; et al.	2003-08-21
Semiconductor package and method for fabricating the same App 20030153123 - Tsai, Chung-Che ; et al.	2003-08-14
Test fixture for semiconductor package and test method of using the same App 20030151420 - Bai, Jin-Chuan ; et al.	2003-08-14
Method of fabricating thin O/N/O stacked dielectric for high-density DRAMs Grant 5,504,021 - Hong , et al. April 2, 1	1996-04-02

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