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Patent applications and USPTO patent grants for Su; Chung-Jui.The latest application filed is for "winding capacitor package structure and method of manufacturing the same".
Patent | Date |
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Winding type capacitor assembly with enhanced structural strength and method of manufacturing the same Grant 11,424,079 - Chen , et al. August 23, 2 | 2022-08-23 |
Winding Capacitor Package Structure And Method Of Manufacturing The Same App 20210391118 - LIN; CHIEH ;   et al. | 2021-12-16 |
Winding Capacitor Package Structure And Method Of Manufacturing The Same App 20210391119 - LIN; CHIEH ;   et al. | 2021-12-16 |
Winding-type Capacitor Package Structure And Method Of Manufacturing The Same App 20210296054 - LIN; CHIEH ;   et al. | 2021-09-23 |
Low leakage electrolytic capacitor Grant 11,004,616 - Chen , et al. May 11, 2 | 2021-05-11 |
Winding Type Capacitor Assembly With Enhanced Structural Strength And Method Of Manufacturing The Same App 20190341197 - CHEN; MING-TSUNG ;   et al. | 2019-11-07 |
Low Leakage Electrolytic Capacitor App 20190096589 - CHEN; MING-TSUNG ;   et al. | 2019-03-28 |
Low Leakage Electrolytic Capacitor App 20180166221 - CHEN; MING-TSUNG ;   et al. | 2018-06-14 |
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