Su; Chun-Hsing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Su; Chun-Hsing.The latest application filed is for "fan-out packages and methods of forming same".
- Su; Chun-Hsing - New Taipei TW
- Su; Chun-Hsing - New Taipei City TW
- Su; Chun-Hsing - Hsinchu TW
| Patent | Date |
|---|---|
| Fan-out packages and methods of forming same Grant 9,847,269 - Lin , et al. December 19, 2 | 2017-12-19 |
| Fan-out Packages And Methods Of Forming Same App 20170033063 - Lin; Jing-Cheng ; et al. | 2017-02-02 |
| Grinding wheel design with elongated teeth arrangement Grant 9,358,660 - Su , et al. June 7, 2 | 2016-06-07 |
| Package for three dimensional integrated circuit Grant 9,337,063 - Chen , et al. May 10, 2 | 2016-05-10 |
| Grinding Wheel Design with Elongated Teeth Arrangement App 20150258657 - Su; Chun-Hsing ; et al. | 2015-09-17 |
| Package for Three Dimensional Integrated Circuit App 20140322866 - Chen; Chih-Hao ; et al. | 2014-10-30 |
| Package for three dimensional integrated circuit Grant 8,772,929 - Chen , et al. July 8, 2 | 2014-07-08 |
| Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2 | 2014-01-14 |
| Package for Three Dimensional Integrated Circuit App 20130119533 - Chen; Chih-Hao ; et al. | 2013-05-16 |
| Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ; et al. | 2013-05-16 |
| Method For Manufacturing Chip Package App 20120052630 - LIN; Chang-Chih ; et al. | 2012-03-01 |
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