| Patent | Date |
|---|
Exclusion zone for stress-sensitive circuit design
Grant 9,691,749 - Su , et al. June 27, 2 | 2017-06-27 |
Lateral Diffused Metal Oxide Semiconductor
App 20150115362 - Su; Chao-Yuan ; et al. | 2015-04-30 |
Lateral Diffused Metal Oxide Semiconductor
App 20150115361 - Su; Chao-Yuan ; et al. | 2015-04-30 |
Exclusion Zone for Stress-Sensitive Circuit Design
App 20140346644 - Su; Chao-Yuan ; et al. | 2014-11-27 |
Exclusion zone for stress-sensitive circuit design
Grant 8,829,653 - Su , et al. September 9, 2 | 2014-09-09 |
Exclusion Zone for Stress-Sensitive Circuit Design
App 20140087492 - Su; Chao-Yuan ; et al. | 2014-03-27 |
Method for packaging semiconductor dies having through-silicon vias
Grant 8,629,563 - Su January 14, 2 | 2014-01-14 |
Exclusion zone for stress-sensitive circuit design
Grant 8,624,346 - Su , et al. January 7, 2 | 2014-01-07 |
Method to improve bump reliability for flip chip device
Grant 8,497,584 - Chen , et al. July 30, 2 | 2013-07-30 |
Method for Packaging Semiconductor Dies Having Through-Silicon Vias
App 20120146238 - Su; Chao-Yuan | 2012-06-14 |
Method for packaging semiconductor dies having through-silicon vias
Grant 8,124,458 - Su February 28, 2 | 2012-02-28 |
Fluxless bumping process
Grant 7,906,425 - Su , et al. March 15, 2 | 2011-03-15 |
Nail-shaped pillar for wafer-level chip-scale packaging
Grant 7,892,962 - Su February 22, 2 | 2011-02-22 |
Method for Packaging Semiconductor Dies Having Through-Silicon Vias
App 20110014749 - Su; Chao-Yuan | 2011-01-20 |
Method for packaging semiconductor dies having through-silicon vias
Grant 7,825,517 - Su November 2, 2 | 2010-11-02 |
High-voltage MOS transistor device
Grant 7,719,076 - Shu , et al. May 18, 2 | 2010-05-18 |
High-voltage MOS transistor device
Grant 7,709,908 - Su , et al. May 4, 2 | 2010-05-04 |
Method For Forming Deep Well Region Of High Voltage Device
App 20090111252 - Huang; Chih-Jen ; et al. | 2009-04-30 |
Nail-Shaped Pillar for Wafer-Level Chip-Scale Packaging
App 20090057896 - Su; Chao-Yuan | 2009-03-05 |
High-voltage Mos Transistor Device
App 20090039425 - Shu; Shih-Ming ; et al. | 2009-02-12 |
High-voltage Mos Transistor Device
App 20090039424 - Su; Chao-Yuan ; et al. | 2009-02-12 |
Method for Packaging Semiconductor Dies Having Through-Silicon Vias
App 20090020865 - Su; Chao-Yuan | 2009-01-22 |
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
Grant 7,468,321 - Ching , et al. December 23, 2 | 2008-12-23 |
Novel substrate design for semiconductor device
App 20080246147 - Su; Chao-Yuan ; et al. | 2008-10-09 |
Stress buffer layer for packaging process
App 20080203566 - Su; Chao-Yuan | 2008-08-28 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
Grant 7,294,937 - Su , et al. November 13, 2 | 2007-11-13 |
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
Grant 7,276,454 - Ching , et al. October 2, 2 | 2007-10-02 |
Underfilling efficiency by modifying the substrate design of flip chips
Grant 7,256,071 - Lee , et al. August 14, 2 | 2007-08-14 |
Exclusion zone for stress-sensitive circuit design
App 20070090547 - Su; Chao-Yuan ; et al. | 2007-04-26 |
Packages, anisotropic conductive films, and conductive particles utilized therein
App 20070063347 - Su; Chao-Yuan | 2007-03-22 |
Fluxless bumping process
App 20070028445 - Su; Chao-Yuan ; et al. | 2007-02-08 |
Semiconductor bond pad structures and methods of manufacturing thereof
Grant 7,157,734 - Tsao , et al. January 2, 2 | 2007-01-02 |
Encapsulation method for SBGA
Grant 7,154,185 - Lee , et al. December 26, 2 | 2006-12-26 |
Semiconductor Bond Pad Structures And Methods Of Manufacturing Thereof
App 20060267008 - Tsao; Pei-Haw ; et al. | 2006-11-30 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
App 20060261490 - Su; Chao-Yuan ; et al. | 2006-11-23 |
Fluxless bumping process
Grant 7,134,199 - Su , et al. November 14, 2 | 2006-11-14 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
Grant 7,126,225 - Su , et al. October 24, 2 | 2006-10-24 |
Non-cavity semiconductor packages
App 20060231960 - Su; Chao-Yuan ; et al. | 2006-10-19 |
Underfilling Efficiency By Modifying The Substrate Design Of Flip Chips
App 20060202351 - Lee; Hsin-Hui ; et al. | 2006-09-14 |
Substrate design to improve chip package reliability
Grant 7,105,920 - Su , et al. September 12, 2 | 2006-09-12 |
Application Of Impressed-current Cathodic Protection To Prevent Metal Corrosion And Oxidation
App 20060194407 - Ching; Kai-Ming ; et al. | 2006-08-31 |
Microelectronics package assembly tool and method of manufacture therewith
Grant 7,098,082 - Su , et al. August 29, 2 | 2006-08-29 |
Novel method for copper wafer wire bonding
App 20060170114 - Su; Chao-Yuan ; et al. | 2006-08-03 |
Underfilling efficiency by modifying the substrate design of flip chips
Grant 7,075,016 - Lee , et al. July 11, 2 | 2006-07-11 |
Test pad and probe card for wafer acceptance testing and other applications
App 20060109014 - Chao; Te-Tsung ; et al. | 2006-05-25 |
Substrate design to improve chip package reliability
App 20060103006 - Su; Chao-Yuan ; et al. | 2006-05-18 |
Fine pitch bonding pad layout and method of manufacturing same
App 20060091535 - Tsao; Pei-Haw ; et al. | 2006-05-04 |
Semiconductor Package Substrate For Flip Chip Packaging
App 20060076681 - Tsao; Pei-Haw ; et al. | 2006-04-13 |
Three dimensional package type stacking for thinner package application
App 20060073635 - Su; Chao-Yuan ; et al. | 2006-04-06 |
Three dimensional package and packaging method for integrated circuits
App 20060065958 - Tsao; Pei-Haw ; et al. | 2006-03-30 |
Stacked packaging methods and structures
App 20060043556 - Su; Chao-Yuan ; et al. | 2006-03-02 |
Method of forming a solder ball using a thermally stable resinous protective layer
Grant 6,974,659 - Su , et al. December 13, 2 | 2005-12-13 |
Microelectronics package assembly tool and method of manufacture therewith
App 20050227409 - Su, Chao-Yuan ; et al. | 2005-10-13 |
Underfilling efficiency by modifying the substrate design of flip chips
App 20050178581 - Lee, Hsin-Hui ; et al. | 2005-08-18 |
Novel encapsulation method for SBGA
App 20050112795 - Lee, Hsin-Hui ; et al. | 2005-05-26 |
Flip chip assembly process and substrate used therewith
App 20040232560 - Su, Chao-Yuan | 2004-11-25 |
Process for bonding solder bumps to a substrate
Grant 6,821,813 - Su November 23, 2 | 2004-11-23 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
App 20040207078 - Su, Chao-Yuan ; et al. | 2004-10-21 |
Fluxless bumping process using ions
Grant 6,805,279 - Lee , et al. October 19, 2 | 2004-10-19 |
Stencil design for solder paste printing
Grant 6,802,250 - Su , et al. October 12, 2 | 2004-10-12 |
Novel method to improve bump reliability for flip chip device
App 20040180296 - Chen, Yen-Ming ; et al. | 2004-09-16 |
Flip chip process of flux-less no-flow underfill
Grant 6,770,510 - Su August 3, 2 | 2004-08-03 |
Method for improving bump reliability for flip chip devices
Grant 6,756,294 - Chen , et al. June 29, 2 | 2004-06-29 |
Process for bonding solder bumps to a substrate
App 20040121576 - Su, Chao-Yuan | 2004-06-24 |
Method of making a wafer level chip scale package
Grant 6,743,660 - Lee , et al. June 1, 2 | 2004-06-01 |
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
App 20040087175 - Ching, Kai-Ming ; et al. | 2004-05-06 |
DFR laminating and film removing system
Grant 6,715,524 - Chen , et al. April 6, 2 | 2004-04-06 |
Fluxless bumping process using ions
App 20040000580 - Lee, Hsin-Hui ; et al. | 2004-01-01 |
Fluxless bumping process
App 20030229986 - Su, Chao-Yuan ; et al. | 2003-12-18 |
DFR laminating and film removing system
App 20030226638 - Chen, Li-Chih ; et al. | 2003-12-11 |
Stencil design for solder paste printing
App 20030213384 - Su, Chao-Yuan ; et al. | 2003-11-20 |
Method of measuring photoresist and bump misalignment
Grant 6,636,313 - Chen , et al. October 21, 2 | 2003-10-21 |
Method to improve reliability for flip-chip device for limiting pad design
Grant 6,602,775 - Chen , et al. August 5, 2 | 2003-08-05 |
Method of measuring photoresist and bump misalignment
App 20030133115 - Chen, Yen-Ming ; et al. | 2003-07-17 |
Method of forming a solder ball using a thermally stable resinous protective layer
App 20030134233 - Su, Chao-Yuan ; et al. | 2003-07-17 |
Method of making a wafer level chip scale package
App 20030134496 - Lee, Hsin-Hui ; et al. | 2003-07-17 |
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