Su; Bor-Rung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Su; Bor-Rung.The latest application filed is for "semiconductor package and manufacturing method thereof".
- Su; Bor-Rung - New Taipei City TW
- Su; Bor-Rung - New Taipei TW
| Patent | Date |
|---|---|
| Semiconductor Package And Manufacturing Method Thereof App 20220216103 - Teng; Po-Yuan ; et al. | 2022-07-07 |
| Semiconductor package and manufacturing method thereof Grant 11,289,373 - Teng , et al. March 29, 2 | 2022-03-29 |
| Packaging device and method of making the same Grant 10,700,033 - Huang , et al. | 2020-06-30 |
| Semicondcutor Package And Manufacturing Method Thereof App 20200043782 - Teng; Po-Yuan ; et al. | 2020-02-06 |
| Packaging Device And Method Of Making The Same App 20180350764 - Huang; Chang-Chia ; et al. | 2018-12-06 |
| Packaging device and method of making the same Grant 10,050,001 - Huang , et al. August 14, 2 | 2018-08-14 |
| Ring structure for chip packaging Grant 9,887,144 - Lin , et al. February 6, 2 | 2018-02-06 |
| Shadow pad for post-passivation interconnect structures Grant 9,748,212 - Liang , et al. August 29, 2 | 2017-08-29 |
| Packaging Device And Method Of Making The Same App 20170005060 - Huang; Chang-Chia ; et al. | 2017-01-05 |
| Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20160322337 - Liang; Shih-Wei ; et al. | 2016-11-03 |
| Packaging device and method of making the same Grant 9,449,933 - Huang , et al. September 20, 2 | 2016-09-20 |
| Packaging Device And Method Of Making The Same App 20130256870 - HUANG; Chang-Chia ; et al. | 2013-10-03 |
| Ring Structure For Chip Packaging App 20130062752 - LIN; Wen-Yi ; et al. | 2013-03-14 |
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