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Patent applications and USPTO patent grants for Su; Bo-Chang.The latest application filed is for "deep trench isolation structures resistant to cracking".
Patent | Date |
---|---|
Deep Trench Isolation Structures Resistant to Cracking App 20220238572 - Wu; Ming-Chi ;   et al. | 2022-07-28 |
Deep trench isolation structures resistant to cracking Grant 11,302,734 - Wu , et al. April 12, 2 | 2022-04-12 |
Semiconductor Device And Method Of Making App 20210366954 - CHEN; Yung-Hsiang ;   et al. | 2021-11-25 |
Deep Trench Isolation Structures Resistant to Cracking App 20200006410 - Wu; Ming-Chi ;   et al. | 2020-01-02 |
MIM capacitors for leakage current improvement Grant 9,543,152 - Huang , et al. January 10, 2 | 2017-01-10 |
Image sensor device and method Grant 9,356,060 - Tai , et al. May 31, 2 | 2016-05-31 |
Mim Capacitors For Leakage Current Improvement App 20160005805 - HUANG; Ching-Hung ;   et al. | 2016-01-07 |
Mechanisms for forming backside illuminated image sensor device structure Grant 9,129,878 - Su , et al. September 8, 2 | 2015-09-08 |
Mechanisms For Forming Backside Illuminated Image Sensor Device Structure App 20150076638 - SU; Bo-Chang ;   et al. | 2015-03-19 |
Image Sensor Device and Method App 20140264701 - Tai; Chih-Ho ;   et al. | 2014-09-18 |
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