Bo Su
USPTO Trademark & Patent Filings
Trademark applications and grants for Bo Su. Bo Su has 4 trademark applications. The latest application filed is for "HYPERKIN"
- Company Aliases
- Bo Su
- Su Bo
- bo su
- SU; Bo - Shanghai CN
- BO; Su - SHANGHAI CN
- SU; Bo - Berkeley CA
- Su; Bo - Shenzhen CN
- Su; Bo - Shanghai CN
- Bo; Su - Shanghai CN
| Entity Type | INDIVIDUAL |
| Address | 38 Hanguang Road Middle Section, Beilin District, Xi 'an City CHINA 710054 |
Trademarks Patents
| Patent Application | Date |
|---|---|
| SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME 20220199808 - 17/226462 OH; Hansu ; et al. | 2022-06-23 |
| METHOD FOR FORMING SEMICONDUCTOR STRUCTURE 20220199460 - 17/520967 LI; Pengchong ; et al. | 2022-06-23 |
| SEMICONDUCTOR DEVICE 20220181482 - 17/677791 ZHANG; Haiyang ; et al. | 2022-06-09 |
| SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF 20210166943 - 16/863289 WEI; Wang ; et al. | 2021-06-03 |
| PROCESS FOR PREPARATION OF AMINO ALCOHOLS 20210155575 - 17/257080 ERNST; Martin ; et al. | 2021-05-27 |
| Train overspeed protection method and apparatus 11,396,312 - 16/472,658 Ouyang , et al. July 26, 2 | 2022-07-26 |
| Semiconductor structure and fabrication method thereof 11,393,685 - 17/029,255 Su , et al. July 19, 2 | 2022-07-19 |
| Semiconductor structure and formation method thereof 11,309,184 - 16/863,289 Wei , et al. April 19, 2 | 2022-04-19 |
| Semiconductor device and fabrication method thereof 11,309,420 - 16/795,864 Zhang , et al. April 19, 2 | 2022-04-19 |
| Semiconductor structure and forming method thereof 11,276,608 - 16/863,343 Wei , et al. March 15, 2 | 2022-03-15 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"HYPERKIN" 90751638 |
HYPERKIN 2021-06-03 |
"NT KING" 90308936 |
NT KING 2020-11-10 |
"NT KING" 90308941 |
NT KING 2020-11-10 |
"X LENT" 5283755 87098846 |
X LENT 2016-07-11 |
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