Patent | Date |
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Hermetically Sealed Electronics Module With Enhanced Cooling Of Core Integrated Circuit App 20220051966 - Sturcken; Keith K. ;   et al. | 2022-02-17 |
Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support Grant 10,854,586 - Dennis , et al. December 1, 2 | 2020-12-01 |
Multi-chip Module Hybrid Integrated Circuit With Multiple Power Zones That Provide Cold Spare Support App 20200373286 - Dennis; Lori D. ;   et al. | 2020-11-26 |
Packaging for high-power microwave module Grant 9,859,178 - Morel , et al. January 2, 2 | 2018-01-02 |
Method and apparatus for cooling electonic components Grant 9,502,269 - Berard , et al. November 22, 2 | 2016-11-22 |
Packaging For High-power Microwave Module App 20160100495 - MOREL; YANNICK C. ;   et al. | 2016-04-07 |
Method And Apparatus For Cooling Electonic Components App 20150289414 - BERARD; ALAN M. ;   et al. | 2015-10-08 |
Method For Fabricating Solder Columns For A Column Grid Array Package App 20140206153 - McIntyre; Thomas J. ;   et al. | 2014-07-24 |
Devices And Methods For Stacking Individually Tested Devices To Form Multi-chip Electronic Modules App 20140175675 - Sturcken; Keith K. ;   et al. | 2014-06-26 |
Method for fabricating solder columns for a column grid array package Grant 8,723,323 - McIntyre , et al. May 13, 2 | 2014-05-13 |
Devices and methods for stacking individually tested devices to form multi-chip electronic modules Grant 8,697,457 - Sturcken , et al. April 15, 2 | 2014-04-15 |
Method For Fabricating Solder Columns For A Column Grid Array Package App 20140015098 - McINTYRE; THOMAS J. ;   et al. | 2014-01-16 |
Isostress Grid Array And Method Of Fabrication Thereof App 20130309815 - Hughes; John A. ;   et al. | 2013-11-21 |
Isostress grid array and method of fabrication thereof Grant 8,586,417 - Hughes , et al. November 19, 2 | 2013-11-19 |
Isostress grid array and method of fabrication thereof Grant 8,519,527 - Hughes , et al. August 27, 2 | 2013-08-27 |
Isostress grid array and method of fabrication thereof App 20110074009 - Hughes; John A. ;   et al. | 2011-03-31 |
Method and apparatus for providing thermal management on high-power integrated circuit devices Grant 7,491,577 - Sturcken , et al. February 17, 2 | 2009-02-17 |
Method and Apparatus for Providing Thermal Management on High-Power Integrated Circuit Devices App 20080164603 - Sturcken; Keith K. ;   et al. | 2008-07-10 |
Programmable resistance memory element with indirect heating Grant 6,969,869 - Hudgens , et al. November 29, 2 | 2005-11-29 |
Method for stacking chips within a multichip module package App 20050078436 - Sturcken, Keith K. ;   et al. | 2005-04-14 |
Programmable resistance memory element with indirect heating App 20040140523 - Hudgens, Steve ;   et al. | 2004-07-22 |
Article comprising a multi-layer electronic package and method therefor Grant 6,734,538 - Sturcken May 11, 2 | 2004-05-11 |
Method for manufacturing a programmable chalcogenide fuse within a semiconductor device Grant 6,692,994 - Davis , et al. February 17, 2 | 2004-02-17 |
Method for stacking chips within a multichip module package App 20030178715 - Sturcken, Keith K. ;   et al. | 2003-09-25 |
Method for manufacturing a programmable chalcogenide fuse within a semiconductor device App 20030045034 - Davis, John D. ;   et al. | 2003-03-06 |
Insitu radiation protection of integrated circuits App 20020195719 - Shah, Tushar K. ;   et al. | 2002-12-26 |
Method for forming a micro column grid array (CGA) App 20020190107 - Shah, Tushar T. ;   et al. | 2002-12-19 |
Ball grid array (BGA) to column grid array (CGA) conversion process Grant 6,492,254 - Sturcken , et al. December 10, 2 | 2002-12-10 |
Programmable chalcogenide fuse within a semiconductor device Grant 6,448,576 - Davis , et al. September 10, 2 | 2002-09-10 |
Insitu radiation protection of integrated circuits App 20020100985 - Shah, Tushar T. ;   et al. | 2002-08-01 |
Ball grid array (BGA) to column grid array (CGA) conversion process App 20020102767 - Sturcken, Keith K. ;   et al. | 2002-08-01 |