Stuempfl; Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stuempfl; Christian.The latest application filed is for "selective plating of semiconductor package leads".

Company Profile

1.20.26

Stuempfl; Christian - Schmidgaden DE
Stuempfl; Christian - Schwandorf DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Selective plating of semiconductor package leads Grant 10,651,109 - Abd Hamid , et al.	2020-05-12
Selective Plating of Semiconductor Package Leads App 20200020607 - Abd Hamid; Syahir ; et al.	2020-01-16
Method for attaching a semiconductor die to a carrier Grant 9,881,909 - Bauer , et al. January 30, 2	2018-01-30
Method for fabricating a semiconductor package and semiconductor package Grant 9,576,935 - Bauer , et al. February 21, 2	2017-02-21
Method for Attaching a Semiconductor Die to a Carrier App 20160126227 - Bauer; Michael ; et al.	2016-05-05
Method for Fabricating a Semiconductor Package and Semiconductor Package App 20150303135 - Bauer; Michael ; et al.	2015-10-22
Electronic component of VQFN design and method for producing the same Grant 8,330,260 - Bauer , et al. December 11, 2	2012-12-11
Semiconductor device having through contacts through a plastic housing composition and method for the production thereof Grant 7,944,061 - Bauer , et al. May 17, 2	2011-05-17
Plastic housing and semiconductor component with said plastic housing Grant 7,919,857 - Bauer , et al. April 5, 2	2011-04-05
Method for manufacturing an electronic component and corresponding electronic component Grant 7,834,460 - Bauer , et al. November 16, 2	2010-11-16
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip Grant 7,749,864 - Bauer , et al. July 6, 2	2010-07-06
Electronic circuit in a package-in-package configuration and production method Grant 7,714,416 - Bauer , et al. May 11, 2	2010-05-11
Electronic structure with components connected by way of solderable connecting elements and method Grant 7,666,777 - Bauer , et al. February 23, 2	2010-02-23
Electronic circuit in a package-on-package configuration and method for producing the same Grant 7,662,664 - Bauer , et al. February 16, 2	2010-02-16
Method for applying a structure of joining material to the back surfaces of semiconductor chips Grant 7,592,236 - Bauer , et al. September 22, 2	2009-09-22
Biosensor with smart card configuration Grant 7,566,968 - Bauer , et al. July 28, 2	2009-07-28
Method for coating a structure comprising semiconductor chips Grant 7,547,645 - Bauer , et al. June 16, 2	2009-06-16
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Grant 7,517,722 - Goller , et al. April 14, 2	2009-04-14
Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof App 20080315399 - Bauer; Michael ; et al.	2008-12-25
Semiconductor module with a semiconductor stack, and methods for its production Grant 7,456,495 - Pohl , et al. November 25, 2	2008-11-25
Semiconductor Device With A Thinned Semiconductor Chip And Method For Producing The Thinned Semiconductor Chip App 20080242057 - Bauer; Michael ; et al.	2008-10-02
Layer For Chip Contact Element App 20080079175 - Bauer; Michael ; et al.	2008-04-03
Module with a shielding and/or heat dissipating element App 20080073756 - Heitzer; Ludwig ; et al.	2008-03-27
Multi-chip Assembly App 20080054451 - Bauer; Michael ; et al.	2008-03-06
Plastic Housing and Semiconductor Component with Said Plastic Housing and Method for Producing the Same App 20080045063 - Bauer; Michael ; et al.	2008-02-21
Electronic Device and Method For Producing the Same App 20080029865 - Bauer; Michael ; et al.	2008-02-07
Electronic Circuit in a Package-On-Package Configuration and Method for Producing the Same App 20080017967 - Bauer; Michael ; et al.	2008-01-24
Electronic Circuit In A Package-in-package Configuration And Production Method App 20080017972 - Bauer; Michael ; et al.	2008-01-24
Electronic Component of VQFN Design and Method for Producing the Same App 20080017986 - Bauer; Michael ; et al.	2008-01-24
Method for manufacturing an electronic component and corresponding electronic component App 20070290346 - Bauer; Michael ; et al.	2007-12-20
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip Grant 7,294,916 - Bauer , et al. November 13, 2	2007-11-13
Electronic component with a plastic package and method for production Grant 7,276,783 - Goller , et al. October 2, 2	2007-10-02
Electronic structure with components connected by way of solderable connecting elements and method App 20070117424 - Bauer; Michael ; et al.	2007-05-24
Method for coating a structure comprising semiconductor chips App 20070105394 - Bauer; Michael ; et al.	2007-05-10
Method for applying a structure of joining material to the back surfaces of semiconductor chips App 20070087532 - Bauer; Michael ; et al.	2007-04-19
Semiconductor Device With A Thinned Semiconductor Chip And Method For Producing The Thinned Semiconductor Chip App 20070042568 - Bauer; Michael ; et al.	2007-02-22
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds App 20060258046 - Goller; Bernd ; et al.	2006-11-16
Biosensor with smart card configuration App 20060027905 - Bauer; Michael ; et al.	2006-02-09
Electronic device configured as a multichip module, leadframe and panel with leadframe positions App 20050184375 - Goller, Bernd ; et al.	2005-08-25
Semiconductor module with a semiconductor stack, and methods for its production App 20050133932 - Pohl, Jens ; et al.	2005-06-23
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device Grant 6,902,951 - Goller , et al. June 7, 2	2005-06-07
Universal package for an electronic component with a semiconductor chip and method for producing the universal package Grant 6,867,471 - Goller , et al. March 15, 2	2005-03-15
Electronic component with a plastic housing and method for production thereof App 20040232543 - Goller, Bernd ; et al.	2004-11-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device App 20040140559 - Goller, Bernd ; et al.	2004-07-22
Universal package for an electronic component with a semiconductor chip and method for producing the universal package App 20040041251 - Goller, Bernd ; et al.	2004-03-04
Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing App 20040043515 - Goller, Bernd ; et al.	2004-03-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.