| Patent | Date |
|---|
Sensor Package And Method For Producing A Sensor Package
App 20220260397 - Strutz; Volker ; et al. | 2022-08-18 |
Sensor device with auxiliary structure for calibrating the sensor device
Grant 11,391,791 - Binder , et al. July 19, 2 | 2022-07-19 |
Sensor devices having a sensor chip and busbar
Grant 11,385,301 - Hoegerl , et al. July 12, 2 | 2022-07-12 |
Sensor package and method for producing a sensor package
Grant 11,326,910 - Strutz , et al. May 10, 2 | 2022-05-10 |
Current Sensor Package With Continuous Insulation
App 20220115585 - Schaller; Rainer Markus ; et al. | 2022-04-14 |
Current sensor package with continuous insulation
Grant 11,211,551 - Schaller , et al. December 28, 2 | 2021-12-28 |
Sensor Apparatuses With A Bypass Current Path And Associated Production Methods
App 20210302474 - ELIAN; Klaus ; et al. | 2021-09-30 |
Package with component connected with carrier via spacer particles
Grant 11,094,619 - Schindler , et al. August 17, 2 | 2021-08-17 |
Sensor Devices Having A Sensor Chip And Busbar
App 20210088600 - HOEGERL; Juergen ; et al. | 2021-03-25 |
Sensor Devices With Sensor Chip And Busbar
App 20210063445 - SCHALLER; Rainer Markus ; et al. | 2021-03-04 |
Sensor Device With Auxiliary Structure For Calibrating The Sensor Device
App 20210011095 - BINDER; Gernot ; et al. | 2021-01-14 |
Sensor Package And Method For Producing A Sensor Package
App 20200056910 - Strutz; Volker ; et al. | 2020-02-20 |
Package With Component Connected With Carrier Via Spacer Particles
App 20200043836 - Schindler; Manfred ; et al. | 2020-02-06 |
Package with component connected at carrier level
Grant 10,515,879 - Schindler , et al. Dec | 2019-12-24 |
Current Sensor Package With Continuous Insulation
App 20190386206 - Schaller; Rainer Markus ; et al. | 2019-12-19 |
Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole
Grant 10,505,102 - Strutz , et al. Dec | 2019-12-10 |
Package with component connected with carrier via spacer particles
Grant 10,438,878 - Schindler , et al. O | 2019-10-08 |
Semiconductor device including antistatic die attach material
Grant 10,304,795 - Strutz , et al. | 2019-05-28 |
Package With Component Connected At Carrier Level
App 20180350727 - Schindler; Manfred ; et al. | 2018-12-06 |
Package With Component Connected With Carrier Via Spacer Particles
App 20180294210 - Schindler; Manfred ; et al. | 2018-10-11 |
Semiconductor Device Including Antistatic Die Attach Material
App 20170352638 - Strutz; Volker ; et al. | 2017-12-07 |
Semiconductor Device Including An Encapsulation Material Defining A Through-hole
App 20170288130 - Strutz; Volker ; et al. | 2017-10-05 |
Semiconductor Device Including Antistatic Die Attach Material
App 20170256515 - Strutz; Volker ; et al. | 2017-09-07 |
Semiconductor device including antistatic die attach material
Grant 9,741,677 - Strutz , et al. August 22, 2 | 2017-08-22 |
Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same
Grant 9,728,493 - Strutz , et al. August 8, 2 | 2017-08-08 |
Semiconductor Devices Having Insulating Substrates and Methods of Formation Thereof
App 20170148981 - von Koblinski; Carsten ; et al. | 2017-05-25 |
Current sensor device
Grant 9,658,296 - Ausserlechner , et al. May 23, 2 | 2017-05-23 |
Semiconductor devices having insulating substrates and methods of formation thereof
Grant 9,608,201 - von Koblinski , et al. March 28, 2 | 2017-03-28 |
Mold PackageD SEMICONDUCTOR CHIP MOUNTED ON A LEADFRAME and Method of Manufacturing the Same
App 20170062312 - Strutz; Volker ; et al. | 2017-03-02 |
Current sensor device
Grant 9,553,208 - Beer , et al. January 24, 2 | 2017-01-24 |
Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
Grant 9,523,720 - Ausserlechner , et al. December 20, 2 | 2016-12-20 |
Electrical circuit
Grant 9,504,143 - Scherr , et al. November 22, 2 | 2016-11-22 |
Semiconductor Devices Having Insulating Substrates And Methods Of Formation Thereof
App 20160284990 - von Koblinski; Carsten ; et al. | 2016-09-29 |
Semiconductor devices having insulating substrates and methods of formation thereof
Grant 9,391,263 - von Koblinski , et al. July 12, 2 | 2016-07-12 |
Electronic array and chip package
Grant 9,111,772 - Strutz , et al. August 18, 2 | 2015-08-18 |
Electronic Array And Chip Package
App 20150214297 - Strutz; Volker ; et al. | 2015-07-30 |
Semiconductor packages and methods for producing the same
Grant 9,013,890 - Ausserlechner , et al. April 21, 2 | 2015-04-21 |
Current Sensor Device
App 20150076636 - Beer; Gottfried ; et al. | 2015-03-19 |
Semiconductor chip package and method
Grant 8,969,985 - Strutz , et al. March 3, 2 | 2015-03-03 |
Current Sensor Device
App 20150015249 - AUSSERLECHNER; Udo ; et al. | 2015-01-15 |
Electrical Circuit
App 20140320147 - Scherr; Wolfgang ; et al. | 2014-10-30 |
Semiconductor packages, systems, and methods of formation thereof
Grant 8,860,153 - Ausserlechner , et al. October 14, 2 | 2014-10-14 |
Multiple Current Sensor Device, A Multiple Current Shunt Device And A Method For Providing A Sensor Signal
App 20140266269 - Ausserlechner; Udo ; et al. | 2014-09-18 |
Semiconductor Devices Having Insulating Substrates and Methods of Formation Thereof
App 20140167192 - von Koblinski; Carsten ; et al. | 2014-06-19 |
Semiconductor Packages, Systems, and Methods of Formation Thereof
App 20140151697 - Ausserlechner; Udo ; et al. | 2014-06-05 |
Semiconductor devices having insulating substrates and methods of formation thereof
Grant 8,722,514 - von Koblinski , et al. May 13, 2 | 2014-05-13 |
Semiconductor Chip Package and Method
App 20130049746 - Strutz; Volker ; et al. | 2013-02-28 |
Semiconductor Devices Having Insulating Substrates and Methods of Formation Thereof
App 20120181640 - von Koblinski; Carsten ; et al. | 2012-07-19 |
Magnetic Field Current Sensors
App 20120146165 - Ausserlechner; Udo ; et al. | 2012-06-14 |
Semiconductor Packages and Methods For Producing The Same
App 20120112365 - Ausserlechner; Udo ; et al. | 2012-05-10 |
Semiconductor component with surface mountable devices and method for producing the same
Grant 8,071,433 - Syri , et al. December 6, 2 | 2011-12-06 |
Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape
Grant 8,026,618 - Syri , et al. September 27, 2 | 2011-09-27 |
Semiconductor device
Grant 7,998,797 - Killer , et al. August 16, 2 | 2011-08-16 |
Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
App 20100323479 - Syri; Erich ; et al. | 2010-12-23 |
Semiconductor module including semiconductor chips in a plastic housing in separate regions
Grant 7,825,506 - Syri , et al. November 2, 2 | 2010-11-02 |
Semiconductor component with surface mountable devices and method for producing the same
Grant 7,804,178 - Syri , et al. September 28, 2 | 2010-09-28 |
Semiconductor Device
App 20100140785 - Killer; Thomas ; et al. | 2010-06-10 |
Cooling system for devices having power semiconductors and method for cooling the device
Grant 7,688,592 - Gruendler , et al. March 30, 2 | 2010-03-30 |
Semiconductor Module Including Semiconductor Chips In A Plastic Housing In Separate Regions
App 20090057874 - Syri; Erich ; et al. | 2009-03-05 |
Semiconductor Device Comprising A Plastic Housing, A Semiconductor Chip and an Interposer, and Method For Producing the Same
App 20080150124 - Syri; Erich ; et al. | 2008-06-26 |
Heat sink for surface-mounted semiconductor devices and mounting method
Grant 7,355,858 - Gruendler , et al. April 8, 2 | 2008-04-08 |
Cooling System For Device Having Power Semiconductors And Method For Cooling The Device
App 20070285895 - Gruendler; Gerold ; et al. | 2007-12-13 |
Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
App 20070262433 - Syri; Erich ; et al. | 2007-11-15 |
Protective device for subassemblies and method for producing a protective device
Grant 7,235,873 - Strutz , et al. June 26, 2 | 2007-06-26 |
Heat sink for surface-mounted semiconductor devices and mounting method
App 20060209513 - Gruendler; Gerold ; et al. | 2006-09-21 |
Protective device with spacer for subassemblies
Grant 6,927,487 - Gebauer , et al. August 9, 2 | 2005-08-09 |
Covering element for subassemblies
Grant 6,903,932 - Wennemuth , et al. June 7, 2 | 2005-06-07 |
Electronic component with a semiconductor chip and method for producing the electronic component
Grant 6,851,598 - Gebauer , et al. February 8, 2 | 2005-02-08 |
Electronic component with external connection elements
Grant 6,815,613 - Gebauer , et al. November 9, 2 | 2004-11-09 |
Package for a semiconductor chip
Grant 6,724,076 - Kahlisch , et al. April 20, 2 | 2004-04-20 |
Electronic component with a semiconductor chip and method for producing the electronic component
App 20030038157 - Gebauer, Uta ; et al. | 2003-02-27 |
Protective device for subassemblies and method for producing a protective device
App 20030024735 - Strutz, Volker ; et al. | 2003-02-06 |
Protective device for subassemblies
App 20030025187 - Strutz, Volker ; et al. | 2003-02-06 |
Protective device with spacer for subassemblies
App 20030025194 - Gebauer, Uta ; et al. | 2003-02-06 |
Covering element for subassemblies
App 20030026077 - Wennemuth, Ingo ; et al. | 2003-02-06 |
Electronic component with external connection elements
App 20020053467 - Gebauer, Uta ; et al. | 2002-05-09 |
Method of producing a semiconductor device
App 20010006830 - Neu, Achim ; et al. | 2001-07-05 |
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