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Patent applications and USPTO patent grants for Strumpell; Mark H..The latest application filed is for "mems device wafer-level package".
Patent | Date |
---|---|
MEMS device wafer-level package Grant 7,466,018 - Kocian , et al. December 16, 2 | 2008-12-16 |
MEMS Device Wafer-Level Package App 20070228540 - Kocian; Thomas A. ;   et al. | 2007-10-04 |
MEMS device wafer-level package Grant 7,226,810 - Kocian , et al. June 5, 2 | 2007-06-05 |
A Non-contacting Electrostatically-driven Mems Device App 20060238852 - Strumpell; Mark H. | 2006-10-26 |
MEMS device wafer-level package App 20050233498 - Kocian, Thomas A. ;   et al. | 2005-10-20 |
MEMS device wafer-level package Grant 6,908,791 - Kocian , et al. June 21, 2 | 2005-06-21 |
Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices Grant 6,908,778 - Strumpell , et al. June 21, 2 | 2005-06-21 |
Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices App 20040043552 - Strumpell, Mark H. ;   et al. | 2004-03-04 |
MEMS device wafer-level package App 20030211654 - Kocian, Thomas A. ;   et al. | 2003-11-13 |
Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices Grant 6,614,576 - Strumpell , et al. September 2, 2 | 2003-09-02 |
Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices App 20020075453 - Strumpell, Mark H. ;   et al. | 2002-06-20 |
Reduced deformation of micromechanical devices through thermal stabilization Grant 6,204,085 - Strumpell , et al. March 20, 2 | 2001-03-20 |
Micromechanical devices with spring tips Grant 5,867,202 - Knipe , et al. February 2, 1 | 1999-02-02 |
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