Stroupe; Hugh E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stroupe; Hugh E..The latest application filed is for "methods for selective removal of material from wafer alignment marks".

Company Profile

0.19.19

Stroupe; Hugh E. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and methods for selective removal of material from wafer alignment marks Grant 8,053,371 - Zahorik , et al. November 8, 2	2011-11-08
Technique for attaching die to leads Grant 7,449,368 - Stroupe November 11, 2	2008-11-11
Technique for attaching die to leads Grant 7,307,353 - Stroupe December 11, 2	2007-12-11
Methods for selective removal of material from wafer alignment marks App 20070207613 - Zahorik; Russell C. ; et al.	2007-09-06
Methods for selective removal of material from wafer alignment marks Grant 7,244,681 - Zahorik, legal representative , et al. July 17,	2007-07-17
Technique for attaching die to leads Grant 7,135,763 - Stroupe November 14, 2	2006-11-14
Technique for attaching die to leads App 20060051897 - Stroupe; Hugh E.	2006-03-09
Apparatus for selective removal of material from wafer alignment marks Grant 6,889,698 - Zahorik , et al. May 10, 2	2005-05-10
Technique for attaching die to leads App 20050092989 - Stroupe, Hugh E.	2005-05-05
Technique for attaching die to leads Grant 6,882,032 - Stroupe April 19, 2	2005-04-19
Method for applying uniform pressurized film across wafer Grant 6,828,227 - Blalock , et al. December 7, 2	2004-12-07
Methods for selective removal of material from wafer alignment marks App 20040038543 - Zahorik, Russell C. ; et al.	2004-02-26
Deadhesion method and mechanism for wafer processing Grant 6,693,034 - Blalock , et al. February 17, 2	2004-02-17
Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing Grant 6,656,402 - Blalock , et al. December 2, 2	2003-12-02
Method for applying uniform pressurized film across wafer Grant 6,653,722 - Blalock , et al. November 25, 2	2003-11-25
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing Grant 6,645,345 - Blalock , et al. November 11, 2	2003-11-11
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing Grant 6,624,089 - Blalock , et al. September 23, 2	2003-09-23
Methods for selective removal of material from wafer alignment marks Grant 6,610,610 - Zahorik , et al. August 26, 2	2003-08-26
Apparatus for selective removal of material from wafer alignment marks App 20030121538 - Zahorik, Russell C. ; et al.	2003-07-03
Method for applying uniform pressurized film across wafer App 20030104691 - Blalock, Guy T. ; et al.	2003-06-05
Technique for attaching die to leads App 20030034490 - Stroupe, Hugh E.	2003-02-20
Deadhesion method and mechanism for wafer processing Grant 6,506,679 - Blalock , et al. January 14, 2	2003-01-14
Deadhesion method and mechanism for wafer processing App 20030008508 - Blalock, Guy T. ; et al.	2003-01-09
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing App 20020187650 - Blalock, Guy T. ; et al.	2002-12-12
Technique for attaching die to leads App 20020180009 - Stroupe, Hugh E.	2002-12-05
Method and apparatus for selective removal of material from wafer alignment marks App 20020144720 - Zahorik, Russell C. ; et al.	2002-10-10
Method for applying uniform pressurized film across wafer App 20020106899 - Blalock, Guy T. ; et al.	2002-08-08
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing Grant 6,410,459 - Blalock , et al. June 25, 2	2002-06-25
Technique for attaching die to leads App 20020047117 - Stroupe, Hugh E.	2002-04-25
Method and apparatus for selective removal of material from wafer alignment marks App 20020025687 - Zahorik, Russell C. ; et al.	2002-02-28
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing App 20020015753 - Blalock, Guy T. ; et al.	2002-02-07
Deadhesion method and mechanism for wafer processing App 20020009825 - Blalock, Guy T. ; et al.	2002-01-24
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing App 20020005260 - Blalock, Guy T. ; et al.	2002-01-17
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing App 20010055686 - Blalock, Guy T. ; et al.	2001-12-27
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing App 20010053446 - Blalock, Guy T. ; et al.	2001-12-20
Method and apparatus for selective removal of material from wafer alignment marks Grant 6,103,636 - Zahorik, deceased , et al. August 15, 2	2000-08-15
Technique for attaching die to leads Grant 5,945,729 - Stroupe August 31, 1	1999-08-31
Method and apparatus for improving planarity of chemical-mechanical planarization operations Grant 5,232,875 - Tuttle , et al. August 3, 1	1993-08-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.