Strong; Veronica

Patent Applications and Registrations

Patent applications and USPTO patent grants for Strong; Veronica.The latest application filed is for "zero-misalignment two-via structures".

Company Profile

9.8.16

Strong; Veronica - Portland OR
Strong; Veronica - Chandler AZ
Strong; Veronica - Hillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnected corrugated carbon-based network Grant 11,397,173 - Strong , et al. July 26, 2	2022-07-26
Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating Grant 11,328,996 - Strong , et al. May 10, 2	2022-05-10
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias App 20220084927 - Aleksov; Aleksandar ; et al.	2022-03-17
Zero-misalignment Two-via Structures App 20220084931 - STRONG; Veronica ; et al.	2022-03-17
Electroless metal-defined thin pad first level interconnects for lithographically defined vias Grant 11,257,745 - Aleksov , et al. February 22, 2	2022-02-22
Zero-misalignment two-via structures Grant 11,222,836 - Strong , et al. January 11, 2	2022-01-11
High-density Interconnects For Integrated Circuit Packages App 20210358855 - Strong; Veronica ; et al.	2021-11-18
Interconnection Structure Fabrication Using Grayscale Lithography App 20210343635 - Swan; Johanna ; et al.	2021-11-04
High-density interconnects for integrated circuit packages Grant 11,133,263 - Strong , et al. September 28, 2	2021-09-28
Heat Spreading Layer Integrated Within A Composite Ic Die Structure And Methods Of Forming The Same App 20210280492 - Liff; Shawna ; et al.	2021-09-09
Interconnection structure fabrication using grayscale lithography Grant 11,101,205 - Swan , et al. August 24, 2	2021-08-24
Heat Spreading Layer Integrated Within A Composite Ic Die Structure And Methods Of Forming The Same App 20210202347 - Liff; Shawna ; et al.	2021-07-01
Heat spreading layer integrated within a composite IC die structure and methods of forming the same Grant 11,049,791 - Liff , et al. June 29, 2	2021-06-29
Organic interposers for integrated circuit packages Grant 10,998,272 - Aleksov , et al. May 4, 2	2021-05-04
Organic Interposers For Integrated Circuit Packages App 20210082822 - Aleksov; Aleksandar ; et al.	2021-03-18
High-density Interconnects For Integrated Circuit Packages App 20210082825 - Strong; Veronica ; et al.	2021-03-18
Dual Sided Thermal Management Solutions For Integrated Circuit Packages App 20210080500 - Braunisch; Henning ; et al.	2021-03-18
Interconnection Structure Fabrication Using Grayscale Lithography App 20210074620 - Swan; Johanna ; et al.	2021-03-11
Zero-misalignment Two-via Structures App 20200294901 - STRONG; Veronica ; et al.	2020-09-17
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias App 20200258827 - A1	2020-08-13
Zero-misalignment Two-via Structures Using Photoimageable Dielectric, Buildup Film, And Electrolytic Plating App 20200258839 - A1	2020-08-13
Interconnected Corrugated Carbon-based Network App 20200232960 - Strong; Veronica ; et al.	2020-07-23
Zero-misalignment Two-via Structures Using Photoimageable Dielectric Film Buildup Film, And Transparent Substrate With Electrole App 20200219814 - STRONG; Veronica ; et al.	2020-07-09
Interconnected Corrugated Carbon-based Network App 20160077074 - Strong; Veronica ; et al.	2016-03-17

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