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Patent applications and USPTO patent grants for Strom; William M..The latest application filed is for "heatsink moldlocks".
Patent | Date |
---|---|
Heatsink moldlocks Grant 8,310,042 - Elliott , et al. November 13, 2 | 2012-11-13 |
Heatsink Moldlocks App 20060220187 - Elliott; Alexander J. ;   et al. | 2006-10-05 |
Miniature moldlocks for heatsink or flag for an overmolded plastic package Grant 7,091,602 - Elliott , et al. August 15, 2 | 2006-08-15 |
Method of making a mount for electronic devices Grant 6,996,897 - Mosna, Jr. , et al. February 14, 2 | 2006-02-14 |
Miniature moldlocks for heatsink or flag for an overmolded plastic package App 20040113262 - Elliott, Alexander J. ;   et al. | 2004-06-17 |
Mounting surfaces for electronic devices App 20040022016 - Mosna, Frank J. JR. ;   et al. | 2004-02-05 |
Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package Grant 5,886,396 - Carney , et al. March 23, 1 | 1999-03-23 |
Process for manufacturing a package for mating with a bare semiconductor die Grant 5,589,402 - Ramsey , et al. December 31, 1 | 1996-12-31 |
Lead frame assembly for surface mount integrated circuit power package Grant 5,587,883 - Olson , et al. December 24, 1 | 1996-12-24 |
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