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Patent applications and USPTO patent grants for STRIPPE; David C..The latest application filed is for "methods of manufacturing semiconductor devices and a semiconductor structure".
Patent | Date |
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Methods Of Manufacturing Semiconductor Devices And A Semiconductor Structure App 20150130064 - ANDERSON; Felix P. ;   et al. | 2015-05-14 |
Methods of manufacturing semiconductor devices and a semiconductor structure Grant 8,969,195 - Anderson , et al. March 3, 2 | 2015-03-03 |
Sputtering target fixture Grant 8,157,970 - Murphy , et al. April 17, 2 | 2012-04-17 |
Methods Of Manufacturing Semiconductor Devices And A Semiconductor Structure App 20090212434 - Anderson; Felix P. ;   et al. | 2009-08-27 |
Method Of System Maintenance Planning Based On Continual Robot Parameter Monitoring App 20090078562 - Johnson; Gary J. ;   et al. | 2009-03-26 |
Sputtering target fixture Grant 7,485,210 - Murphy , et al. February 3, 2 | 2009-02-03 |
Sputtering Target Fixture App 20080264783 - Murphy; William J. ;   et al. | 2008-10-30 |
Sputtering Target Fixture App 20060076230 - Murphy; William J. ;   et al. | 2006-04-13 |
Sputtered tungsten diffusion barrier for improved interconnect robustness Grant 6,838,364 - Brodsky , et al. January 4, 2 | 2005-01-04 |
Version with markings to show changes made App 20010029096 - Brodsky, Stephen B. ;   et al. | 2001-10-11 |
Sputtered tungsten diffusion barrier for improved interconnect robustness Grant 6,245,668 - Brodsky , et al. June 12, 2 | 2001-06-12 |
High power capacity magnetron cathode Grant 5,628,889 - Gardell , et al. May 13, 1 | 1997-05-13 |
Method of depositing conductors in high aspect ratio apertures under high temperature conditions Grant 5,529,670 - Ryan , et al. June 25, 1 | 1996-06-25 |
Method of depositing conductors in high aspect ratio apertures using a collimator Grant 5,401,675 - Lee , et al. March 28, 1 | 1995-03-28 |
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