Straznicky; Ivan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Straznicky; Ivan.The latest application filed is for "thermal treatment for preconditioning or restoration of a solder joint".

Company Profile

0.10.10

Straznicky; Ivan - Carleton Place CA
STRAZNICKY; Ivan - Kanata CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for near-end crosstalk reduction Grant 11,304,289 - Sullivan , et al. April 12, 2	2022-04-12
Thermal Treatment for Preconditioning or Restoration of a Solder Joint App 20180345395 - SNUGOVSKY; Polina ; et al.	2018-12-06
Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module Grant 9,526,191 - Straznicky , et al. December 20, 2	2016-12-20
Circuit Card Apparatus And Methods App 20150289359 - Schmidt; Bob ; et al.	2015-10-08
Manufacturing process and heat dissipating device for forming interface for electronic component Grant 8,941,234 - Straznicky , et al. January 27, 2	2015-01-27
Fluid Cooled Enclosure For Circuit Module Apparatus And Methods Of Cooling A Conduction Cooled Circuit Module App 20140340845 - Straznicky; Ivan ; et al.	2014-11-20
Manufacturing Process And Heat Dissipating Device For Forming Interface For Electronic Component App 20140209284 - Straznicky; Ivan ; et al.	2014-07-31
Manufacturing process and heat dissipating device for forming interface for electronic component Grant 8,728,872 - Straznicky , et al. May 20, 2	2014-05-20
Tamper respondent module Grant 8,687,371 - Arshad , et al. April 1, 2	2014-04-01
Tamper Respondent Module App 20130058052 - Arshad; Nauman ; et al.	2013-03-07
Manufacturing Process And Heat Dissipating Device For Forming Interface For Electronic Component App 20130043015 - Straznicky; Ivan ; et al.	2013-02-21
Tamper respondent module Grant 8,325,486 - Arshad , et al. December 4, 2	2012-12-04
Tamper Respondent Module App 20100177487 - Arshad; Nauman ; et al.	2010-07-15
Adjustable height liquid cooler in liquid flow through plate Grant 7,515,418 - Straznicky , et al. April 7, 2	2009-04-07
Adjustable height liquid cooler in liquid flow through plate App 20070070605 - Straznicky; Ivan ; et al.	2007-03-29
Supplemental heat conduction path for card to chassis heat dissipation Grant 6,873,528 - Hulan , et al. March 29, 2	2005-03-29
Embedded heat pipe for a conduction cooled circuit card assembly Grant 6,839,235 - St. Louis , et al. January 4, 2	2005-01-04
Embedded Heat Pipe For A Conduction Cooled Circuit Card Assembly App 20040120116 - St. Louis, Chad ; et al.	2004-06-24

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