| Patent | Date |
|---|
Methods and systems for use in grind spindle alignment
Grant 9,610,669 - Walsh , et al. April 4, 2 | 2017-04-04 |
Methods and systems for use in grind shape control adaptation
Grant 9,457,446 - Brake , et al. October 4, 2 | 2016-10-04 |
Systems and methods of processing substrates
Grant 9,393,669 - Kalenian , et al. July 19, 2 | 2016-07-19 |
CMP retaining ring with soft retaining ring insert
Grant 9,193,030 - Kalenian , et al. November 24, 2 | 2015-11-24 |
Method of grinding wafer stacks to provide uniform residual silicon thickness
Grant 9,082,713 - Brake , et al. July 14, 2 | 2015-07-14 |
Method Of Grinding Wafer Stacks To Provide Uniform Residual Silicon Thickness
App 20150118826 - Kalenian; William J. ; et al. | 2015-04-30 |
Systems and methods of wafer grinding
Grant 8,968,052 - Walsh , et al. March 3, 2 | 2015-03-03 |
Cmp Retaining Ring With Soft Retaining Ring Insert
App 20140287657 - Kalenian; William J. ; et al. | 2014-09-25 |
CMP retaining ring with soft retaining ring insert
Grant 8,740,673 - Kalenian , et al. June 3, 2 | 2014-06-03 |
Methods And Systems For Use In Grind Shape Control Adaptation
App 20140134923 - Brake; Thomas E. ; et al. | 2014-05-15 |
Methods And Systems For Use In Grind Spindle Alignment
App 20140134927 - Walsh; Thomas A. ; et al. | 2014-05-15 |
Method, apparatus and system for use in processing wafers
Grant 8,565,919 - Kalenian , et al. October 22, 2 | 2013-10-22 |
System and method for in situ monitoring of top wafer thickness in a stack of wafers
Grant 8,520,222 - Schraub , et al. August 27, 2 | 2013-08-27 |
Systems And Methods Of Processing Substrates
App 20130130593 - Kalenian; William J. ; et al. | 2013-05-23 |
System and Method for In Situ Monitoring of Top Wafer Thickness in a Stack of Wafers
App 20130114090 - Schraub; Frederic Anthony ; et al. | 2013-05-09 |
Systems And Methods Of Wafer Grinding
App 20130102227 - Walsh; Thomas A. ; et al. | 2013-04-25 |
Wafer Carrier with Flexible Pressure Plate
App 20130078812 - Spiegel; Larry A. ; et al. | 2013-03-28 |
CMP system with wireless endpoint detection system
Grant 8,182,312 - Truer , et al. May 22, 2 | 2012-05-22 |
CMP Retaining Ring with Soft Retaining Ring Insert
App 20120088366 - Kalenian; William J. ; et al. | 2012-04-12 |
Method, apparatus and system for use in processing wafers
Grant 8,052,504 - Kalenian , et al. November 8, 2 | 2011-11-08 |
Flexible membrane assembly for a CMP system and method of using
Grant 7,959,496 - Spiegel June 14, 2 | 2011-06-14 |
Endpoint detection system for wafer polishing
Grant 7,918,712 - Wolf April 5, 2 | 2011-04-05 |
CMP System with Wireless Endpoint Detection System
App 20100062685 - Truer; Randolph E. ; et al. | 2010-03-11 |
Flexible Membrane Assembly for a CMP System
App 20090176445 - Spiegel; Larry A. | 2009-07-09 |
Methods for optical endpoint detection during semiconductor wafer polishing
Grant 7,549,909 - Dalrymple , et al. June 23, 2 | 2009-06-23 |
Robot calibration system and method
Grant 7,551,979 - Saraliev June 23, 2 | 2009-06-23 |
Endpoint detection system for wafer polishing
App 20090061734 - Wolf; Stephan H. | 2009-03-05 |
Back pressure control system for CMP and wafer polishing
Grant 7,467,990 - Strasbaugh December 23, 2 | 2008-12-23 |
Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
App 20080032602 - Dalrymple; Alice Madrone ; et al. | 2008-02-07 |
Method, Apparatus And System For Use In Processing Wafers
App 20070269986 - Kalenian; William J. ; et al. | 2007-11-22 |
Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
App 20070235133 - Benassi; Robert | 2007-10-11 |
Method, apparatus and system for use in processing wafers
Grant 7,249,992 - Kalenian , et al. July 31, 2 | 2007-07-31 |
Wafer carrier with pressurized membrane and retaining ring actuator
Grant 7,238,083 - Fuhriman , et al. July 3, 2 | 2007-07-03 |
Robot calibration system and method
App 20070150100 - Saraliev; Daniel P. | 2007-06-28 |
Devices and methods for optical endpoint detection during semiconductor wafer polishing
Grant 7,235,154 - Dalrymple , et al. June 26, 2 | 2007-06-26 |
Wafer Carrier Pivot Mechanism
App 20070105491 - Walsh; Thomas A. ; et al. | 2007-05-10 |
Endpoint detection system for wafer polishing
Grant 7,195,541 - Wolf March 27, 2 | 2007-03-27 |
Wafer carrier with pressurized membrane and retaining ring actuator
App 20070054603 - Fuhriman; John ; et al. | 2007-03-08 |
Polishing pad with built-in optical sensor
App 20070032170 - Halley; David G. ; et al. | 2007-02-08 |
Independent edge control for CMP carriers
App 20070010181 - Spiegel; Larry A. | 2007-01-11 |
Chuck for supporting wafers with a fluid
Grant 7,160,808 - Kassir January 9, 2 | 2007-01-09 |
Wafer carrier pivot mechanism
Grant 7,156,946 - Walsh , et al. January 2, 2 | 2007-01-02 |
Wafer carrier with pressurized membrane and retaining ring actuator
Grant 7,131,892 - Fuhriman , et al. November 7, 2 | 2006-11-07 |
Endpoint detection system for wafer polishing
App 20060217038 - Wolf; Stephan H. | 2006-09-28 |
Chemical-mechanical planarization tool force calibration method and system
App 20060205322 - Kalenian; William ; et al. | 2006-09-14 |
Wafer Carrier With Pressurized Membrane And Retaining Ring Actuator
App 20060194519 - Fuhriman; John ; et al. | 2006-08-31 |
Back pressure control system for CMP and wafer polishing
App 20060166611 - Strasbaugh; Alan | 2006-07-27 |
Independent edge control for CMP carriers
Grant 7,063,604 - Spiegel June 20, 2 | 2006-06-20 |
Retaining ring for wafer carriers
Grant 7,063,605 - Spiegel June 20, 2 | 2006-06-20 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck
Grant 7,059,942 - Strasbaugh , et al. June 13, 2 | 2006-06-13 |
Endpoint detection system for wafer polishing
Grant 7,052,366 - Wolf May 30, 2 | 2006-05-30 |
Chemical-mechanical planarization tool force calibration method and system
Grant 7,040,955 - Kalenian , et al. May 9, 2 | 2006-05-09 |
Wafer carrier with pressurized membrane and retaining ring actuator
Grant 7,033,252 - Fuhriman , et al. April 25, 2 | 2006-04-25 |
Protection of work piece during surface processing
Grant 7,018,268 - Kassir , et al. March 28, 2 | 2006-03-28 |
Back pressure control system for CMP and wafer polishing
Grant 7,008,309 - Strasbaugh March 7, 2 | 2006-03-07 |
Method, apparatus and system for use in processing wafers
App 20060035563 - Kalenian; William J. ; et al. | 2006-02-16 |
Polishing pad with built-in optical sensor
Grant 6,986,701 - Halley , et al. January 17, 2 | 2006-01-17 |
In situ feature height measurement
Grant 6,976,901 - Halley , et al. December 20, 2 | 2005-12-20 |
Wafer carrier with pressurized membrane and retaining ring actuator
App 20050215182 - Fuhriman, John ; et al. | 2005-09-29 |
Subaperture chemical mechanical planarization with polishing pad conditioning
Grant 6,945,856 - Boyd , et al. September 20, 2 | 2005-09-20 |
Independent edge control for CMP carriers
App 20050202765 - Spiegel, Larry A. | 2005-09-15 |
Retaining ring for wafer carriers
App 20050164617 - Spiegel, Larry A. | 2005-07-28 |
Devices and methods for optical endpoint detection during semiconductor wafer polishing
App 20050150599 - Dalrymple, Alice Madrone ; et al. | 2005-07-14 |
Pad support method for chemical mechanical planarization
Grant 6,887,133 - Halley May 3, 2 | 2005-05-03 |
Polishing pad sensor assembly with a damping pad
Grant 6,884,150 - Barbour April 26, 2 | 2005-04-26 |
Device for supporting thin semiconductor wafers
Grant 6,885,206 - Halley April 26, 2 | 2005-04-26 |
Slurry pump control system
Grant 6,878,037 - Melcer April 12, 2 | 2005-04-12 |
Retaining Ring For Wafer Carriers
App 20050075062 - Spiegel, Larry A. | 2005-04-07 |
Retaining ring for wafer carriers
Grant 6,869,348 - Spiegel March 22, 2 | 2005-03-22 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck
Grant 6,866,564 - Strasbaugh , et al. March 15, 2 | 2005-03-15 |
Modular method for chemical mechanical planarization
Grant 6,855,030 - Halley February 15, 2 | 2005-02-15 |
Chuck for supporting wafers with a fluid
App 20050009349 - Kassir, Salman M. | 2005-01-13 |
Polishing pad with built-in optical sensor
App 20050009449 - Halley, David G. ; et al. | 2005-01-13 |
Back pressure control system for CMP and wafer polishing
App 20040242135 - Strasbaugh, Alan | 2004-12-02 |
Endpoint detection system for wafer polishing
App 20040229545 - Wolf, Stephan H. | 2004-11-18 |
Wafer carrier pivot mechanism
App 20040226656 - Walsh, Thomas A. ; et al. | 2004-11-18 |
Grinding apparatus and method
App 20040198196 - Walsh, Thomas A. ; et al. | 2004-10-07 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck
App 20040157536 - Strasbaugh, Alan ; et al. | 2004-08-12 |
Support for thin wafers
App 20040155671 - Halley, David G. | 2004-08-12 |
Slurry pump control system
App 20040142636 - Melcer, Chris | 2004-07-22 |
Method of spin etching wafers with an alkali solution
Grant 6,743,722 - Kassir June 1, 2 | 2004-06-01 |
Polishing pad with built-in optical sensor
Grant 6,739,945 - Halley , et al. May 25, 2 | 2004-05-25 |
Polishing pad with optical sensor
Grant 6,726,528 - Barbour April 27, 2 | 2004-04-27 |
Modular method for chemical mechanical planarization
App 20040048550 - Halley, David G. | 2004-03-11 |
Endpoint detection system for wafer polishing
Grant 6,695,681 - Wolf February 24, 2 | 2004-02-24 |
Method for making a polishing pad with built-in optical sensor
Grant 6,696,005 - Strasbaugh February 24, 2 | 2004-02-24 |
Combined chemical mechanical planarization and cleaning
Grant 6,692,339 - Halley February 17, 2 | 2004-02-17 |
Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers
Grant 6,638,389 - Kassir , et al. October 28, 2 | 2003-10-28 |
Feature height measurement during CMP
Grant 6,629,874 - Halley October 7, 2 | 2003-10-07 |
Subaperture chemical mechanical planarization with polishing pad conditioning
App 20030153250 - Boyd, John M. ; et al. | 2003-08-14 |
Pad support apparatus for chemical mechanical planarization
Grant 6,602,121 - Halley August 5, 2 | 2003-08-05 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck
App 20030134578 - Strasbaugh, Alan ; et al. | 2003-07-17 |
Endpoint detection system for wafer polishing
App 20030109196 - Wolf, Stephan H. | 2003-06-12 |
High planarity chemical mechanical planarization
Grant 6,520,843 - Halley February 18, 2 | 2003-02-18 |
Shaping polishing pad for small head chemical mechanical planarization
Grant 6,517,419 - Halley February 11, 2 | 2003-02-11 |
Polishing chemical delivery for small head chemical mechanical planarization
Grant 6,514,121 - Halley February 4, 2 | 2003-02-04 |
Pad quick release device for chemical mechanical planarization
Grant 6,464,574 - Halley October 15, 2 | 2002-10-15 |
Multi-pad apparatus for chemical mechanical planarization
Grant 6,346,036 - Halley February 12, 2 | 2002-02-12 |
Pad quick release device for chemical mechanical polishing
Grant 6,227,956 - Halley May 8, 2 | 2001-05-08 |
Chemical mechanical polishing apparatus and method
Grant 6,045,716 - Walsh , et al. April 4, 2 | 2000-04-04 |
Grinding process and apparatus for planarizing sawed wafers
Grant 5,964,646 - Kassir , et al. October 12, 1 | 1999-10-12 |
Apparatus for sensing the presence of a wafer
Grant 5,961,169 - Kalenian , et al. October 5, 1 | 1999-10-05 |
| 