| Patent | Date |
|---|
Thermal management and/or EMI mitigation materials including coated fillers
Grant 11,411,263 - Strader , et al. August 9, 2 | 2022-08-09 |
Thermally-conductive Electromagnetic Interference (emi) Absorbers Including Aluminum Powder
App 20210368659 - STRADER; Jason L. | 2021-11-25 |
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources
App 20210202343 - STRADER; Jason L. ; et al. | 2021-07-01 |
System for applying interface materials
Grant 11,014,203 - Kittel , et al. May 25, 2 | 2021-05-25 |
Devices for absorbing energy from electronic components
Grant 10,978,369 - Strader , et al. April 13, 2 | 2021-04-13 |
Thermal management assemblies suitable for use with transceivers and other devices
Grant 10,965,333 - English , et al. March 30, 2 | 2021-03-30 |
Methods for establishing thermal joints between heat spreaders or lids and heat sources
Grant 10,964,617 - Strader , et al. March 30, 2 | 2021-03-30 |
Thermal Interface Materials Including Memory Foam Cores
App 20210068304 - STRADER; Jason L. ; et al. | 2021-03-04 |
Systems And Methods Of Applying Materials to Components
App 20210028142 - STRADER; Jason L. ; et al. | 2021-01-28 |
Thermal Management and/or EMI Mitigation Materials Including Coated Fillers
App 20200287253 - STRADER; Jason L. ; et al. | 2020-09-10 |
Systems of applying materials to components
Grant 10,741,519 - Strader , et al. A | 2020-08-11 |
Highly compliant non-silicone putties and thermal interface materials including the same
Grant 10,741,471 - Strader , et al. A | 2020-08-11 |
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources
App 20200219785 - STRADER; Jason L. ; et al. | 2020-07-09 |
Methods of applying thermal interface materials to board level shields
Grant 10,687,447 - Talpallikar , et al. | 2020-06-16 |
Material having an edge shape
Grant D881,822 - Wladyka , et al. | 2020-04-21 |
Material having edging
Grant D879,046 - Wladyka , et al. | 2020-03-24 |
Methods for establishing thermal joints between heat spreaders or lids and heat sources
Grant 10,600,714 - Strader , et al. | 2020-03-24 |
Devices For Absorbing Energy From Electronic Components
App 20200051891 - STRADER; Jason L. ; et al. | 2020-02-13 |
Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components
Grant 10,555,439 - Johnson , et al. Fe | 2020-02-04 |
Thermal Management Assemblies Suitable for Use with Transceivers and Other Devices
App 20190379417 - ENGLISH; Gerald R. ; et al. | 2019-12-12 |
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources
App 20190371697 - STRADER; Jason L. ; et al. | 2019-12-05 |
Board level shields and systems and methods of applying board level shielding
Grant 10,477,738 - Strader , et al. Nov | 2019-11-12 |
Devices for absorbing energy from electronic components
Grant 10,453,773 - Strader , et al. Oc | 2019-10-22 |
Small form-factor pluggable (SFP) transceivers
Grant 10,389,397 - Edgren , et al. A | 2019-08-20 |
Methods for establishing thermal joints between heat spreaders or lids and heat sources
Grant 10,373,891 - Strader , et al. | 2019-08-06 |
Highly Compliant Non-silicone Putties And Thermal Interface Materials Including The Same
App 20190229035 - STRADER; Jason L. ; et al. | 2019-07-25 |
Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
Grant 10,334,716 - Strader , et al. | 2019-06-25 |
Thermal Interface Materials With Reinforcement For Abrasion Resistance And/Or Suitable For Use Between Sliding Components
App 20190132994 - JOHNSON; Keith David ; et al. | 2019-05-02 |
Materials Including Thermally Reversible Gels
App 20190023962 - BRUZDA; Karen J. ; et al. | 2019-01-24 |
Systems And Methods Of Applying Thermal Interface Materials
App 20190013291 - STRADER; Jason L. ; et al. | 2019-01-10 |
Materials including thermally reversible gels
Grant 10,087,351 - Bruzda , et al. October 2, 2 | 2018-10-02 |
Board Level Shields And Systems And Methods Of Applying Board Level Shielding
App 20180255666 - STRADER; Jason L. ; et al. | 2018-09-06 |
Devices For Absorbing Energy From Electronic Components
App 20180182685 - Strader; Jason L. ; et al. | 2018-06-28 |
Multifunctional Components For Electronic Devices And Related Methods Of Providing Thermal Management And Board Level Shielding
App 20180153031 - Strader; Jason L. ; et al. | 2018-05-31 |
Board Level Shields Including Thermal Interface Materials And Methods Of Applying Thermal Interface Materials To Board Level Shields
App 20180110158 - Talpallikar; Sri ; et al. | 2018-04-19 |
Materials Including Thermally Reversible Gels
App 20180079946 - Bruzda; Karen J. ; et al. | 2018-03-22 |
Small Form-factor Pluggable (sfp) Transceivers
App 20180034492 - Edgren; Bjorn ; et al. | 2018-02-01 |
Systems And Methods Of Applying Thermal Interface Materials
App 20180009072 - Kittel; Mark D. ; et al. | 2018-01-11 |
Thermal interface materials with thin film or metallization
Grant 9,795,059 - Strader , et al. October 17, 2 | 2017-10-17 |
Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
Grant 9,781,819 - Strader October 3, 2 | 2017-10-03 |
Thermal interface materials including thermally reversible gels
Grant 9,771,508 - Bruzda , et al. September 26, 2 | 2017-09-26 |
Multifunctional Components For Electronic Devices And Related Methods Of Providing Thermal Management And Board Level Shielding
App 20170034900 - Strader; Jason L. | 2017-02-02 |
Thermal interface materials
Grant 9,515,004 - Strader , et al. December 6, 2 | 2016-12-06 |
Reusable Thermoplastic Thermal Interface Materials And Methods For Establishing Thermal Joints Between Heat Sources And Heat Dissipating/removal Structures
App 20160315030 - Strader; Jason L. ; et al. | 2016-10-27 |
Mid-plates And Electromagnetic Interference (emi) Board Level Shields With Embedded And/or Internal Heat Spreaders
App 20160242321 - van Haaster; Philip ; et al. | 2016-08-18 |
Thermally-conductive Electromagnetic Interference (emi) Absorbers With Silicon Carbide
App 20160233173 - Do; Hoang Dinh ; et al. | 2016-08-11 |
Thermal Interface Materials Including Thermally Reversible Gels
App 20160160104 - Bruzda; Karen J. ; et al. | 2016-06-09 |
Thermal interface material assemblies and related methods
Grant 9,330,998 - Strader , et al. May 3, 2 | 2016-05-03 |
Thermal Interface Material Assemblies And Related Methods
App 20150305189 - Strader; Jason L. ; et al. | 2015-10-22 |
Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader
App 20150301568 - Hill; Richard F. ; et al. | 2015-10-22 |
Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
App 20140368992 - Strader; Jason L. ; et al. | 2014-12-18 |
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources
App 20140367847 - Strader; Jason L. ; et al. | 2014-12-18 |
Thermal Interface Materials
App 20140262191 - Strader; Jason L. ; et al. | 2014-09-18 |
Thermal interface material assemblies, and related methods
Grant 8,647,752 - Strader , et al. February 11, 2 | 2014-02-11 |
Thermal Interface Materials with Thin Film or Metallization
App 20130265721 - Strader; Jason L. ; et al. | 2013-10-10 |
Thermal interface material with thin transfer film or metallization
Grant 8,445,102 - Strader , et al. May 21, 2 | 2013-05-21 |
Thermal Interface Material Assemblies, And Related Methods
App 20110310562 - Strader; Jason L. ; et al. | 2011-12-22 |
Thermal Interface Material With Thin Transfer Film Or Metallization
App 20090117345 - Strader; Jason L. ; et al. | 2009-05-07 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
Grant 7,369,411 - Hill , et al. May 6, 2 | 2008-05-06 |
Heat spreading thermal interface structure
App 20050045372 - Hill, Richard F. ; et al. | 2005-03-03 |
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
Grant 6,617,517 - Hill , et al. September 9, 2 | 2003-09-09 |
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
App 20020154485 - Hill, Richard F. ; et al. | 2002-10-24 |
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