Storli; Farrah J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Storli; Farrah J..The latest application filed is for "methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods".

Company Profile

0.6.5

Storli; Farrah J. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Grant 7,572,725 - Storli August 11, 2	2009-08-11
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Grant 7,218,003 - Storli May 15, 2	2007-05-15
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods App 20070040273 - Storli; Farrah J.	2007-02-22
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Grant 7,018,869 - Storli March 28, 2	2006-03-28
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods App 20050167822 - Storli, Farrah J.	2005-08-04
Microelectronic package with reduced underfill and methods for forming such packages Grant 6,900,080 - Jiang , et al. May 31, 2	2005-05-31
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Grant 6,885,101 - Storli April 26, 2	2005-04-26
Microelectronic package with reduced underfill and methods for forming such packages App 20050016751 - Jiang, Tongbi ; et al.	2005-01-27
Microelectronic package with reduced underfill and methods for forming such packages Grant 6,844,618 - Jiang , et al. January 18, 2	2005-01-18
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods App 20040041271 - Storli, Farrah J.	2004-03-04
Microelectronic package with reduced underfill and methods for forming such packages App 20030189243 - Jiang, Tongbi ; et al.	2003-10-09

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