Stone; David B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stone; David B..The latest application filed is for "shielded package assemblies with integrated capacitor".

Company Profile

4.59.54

Stone; David B. - Jericho VT
Stone; David B. - Essex Junction VT
Stone; David B. - Williamsport PA
Stone, David B. - Marion MA
Stone; David B. - Burlington VT
Stone; David B. - Cranford NJ
Stone; David B. - Owego NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shielded package assemblies with integrated capacitor Grant 11,049,819 - Lamorey , et al. June 29, 2	2021-06-29
Interconnected integrated circuit (IC) chip structure and packaging and method of forming same Grant 10,714,411 - Sauter , et al.	2020-07-14
Reduced-warpage laminate structure Grant 10,685,919 - Lamorey , et al.	2020-06-16
Shielded Package Assemblies With Integrated Capacitor App 20200083177 - Lamorey; Mark C. ; et al.	2020-03-12
Shielded package assemblies with integrated capacitor Grant 10,553,544 - Lamorey , et al. Fe	2020-02-04
Fan-out Connections Of Processors On A Panel Assembly App 20190363047 - Blackshear; Edmund ; et al.	2019-11-28
Split ball grid array pad for multi-chip modules Grant 10,483,233 - Call , et al. Nov	2019-11-19
Interconnected Integrated Circuit (ic) Chip Structure And Packaging And Method Of Forming Same App 20190287879 - Sauter; Wolfgang ; et al.	2019-09-19
Shielded package assemblies with integrated capacitor Grant 9,935,058 - Lamorey , et al. April 3, 2	2018-04-03
Shielded Package Assemblies With Integrated Capacitor App 20180068957 - Lamorey; Mark C. ; et al.	2018-03-08
Reduced-warpage Laminate Structure App 20170148749 - Lamorey; Mark C. ; et al.	2017-05-25
Split Ball Grid Array Pad For Multi-chip Modules App 20170141078 - Call; Anson J. ; et al.	2017-05-18
Shielded Package Assemblies With Integrated Capacitor App 20170125358 - Lamorey; Mark C. ; et al.	2017-05-04
Split ball grid array pad for multi-chip modules Grant 9,633,914 - Call , et al. April 25, 2	2017-04-25
Reduced-warpage laminate structure Grant 9,613,915 - Lamorey , et al. April 4, 2	2017-04-04
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures Grant 9,599,664 - Lacroix , et al. March 21, 2	2017-03-21
Split Ball Grid Array Pad For Multi-chip Modules App 20170077000 - Call; Anson J. ; et al.	2017-03-16
Chamfered corner crackstop for an integrated circuit chip Grant 9,543,254 - Lamorey , et al. January 10, 2	2017-01-10
Reduced-warpage laminate structure Grant 9,543,255 - Lamorey , et al. January 10, 2	2017-01-10
Shielded package assemblies with integrated capacitor Grant 9,531,209 - Lamorey , et al. December 27, 2	2016-12-27
Reduced-warpage Laminate Structure App 20160155708 - Lamorey; Mark C. ; et al.	2016-06-02
Reduced-warpage Laminate Structure App 20160157357 - Lamorey; Mark C. ; et al.	2016-06-02
Packages for three-dimensional die stacks Grant 9,252,101 - Lamorey , et al. February 2, 2	2016-02-02
Method, structures and method of designing reduced delamination integrated circuits Grant 9,245,083 - Lamorey , et al. January 26, 2	2016-01-26
Organic module EMI shielding structures and methods Grant 9,245,854 - Brodsky , et al. January 26, 2	2016-01-26
Shielded package assemblies with integrated capacitor Grant 9,209,141 - Lamorey , et al. December 8, 2	2015-12-08
Shielded Package Assemblies With Integrated Capacitor App 20150349565 - Lamorey; Mark C. ; et al.	2015-12-03
Thermally enhanced three-dimensional integrated circuit package Grant 9,190,399 - Lamorey , et al. November 17, 2	2015-11-17
Integrated circuit structures having off-axis in-hole capacitor Grant 9,185,807 - Lamorey , et al. November 10, 2	2015-11-10
Thermally Enhanced Three-dimensional Integrated Circuit Package App 20150255441 - Lamorey; Mark C. ; et al.	2015-09-10
Chamfered Corner Crackstop For An Integrated Circuit Chip App 20150255405 - Lamorey; Mark C. ; et al.	2015-09-10
Circuit For Detecting Structural Defects In An Integrated Circuit Chip, Methods Of Use And Manufacture And Design Structures App 20150247896 - Lacroix; Luke D. ; et al.	2015-09-03
Integrated Circuit Structures Having Off-axis In-hole Capacitor App 20150245491 - Lamorey; Mark C. ; et al.	2015-08-27
Shielded Package Assemblies With Integrated Capacitor App 20150243609 - Lamorey; Mark C. ; et al.	2015-08-27
Packages For Three-dimensional Die Stacks App 20150214155 - Lamorey; Mark C. ; et al.	2015-07-30
Packaging identical chips in a stacked structure Grant 9,093,445 - Colgan , et al. July 28, 2	2015-07-28
Method, Structures And Method Of Designing Reduced Delamination Integrated Circuits App 20150206835 - Lamorey; Mark C. H. ; et al.	2015-07-23
Semiconductor test and monitoring structure to detect boundaries of safe effective modulus Grant 9,087,805 - Crain, Jr. , et al. July 21, 2	2015-07-21
Packages For Three-dimensional Die Stacks App 20150194364 - Lamorey; Mark C. ; et al.	2015-07-09
Integrated Circuit Structures Having Off-axis In-hole Capacitor And Methods Of Forming App 20150195914 - Lamorey; Mark C. ; et al.	2015-07-09
Integrated circuit structures having off-axis in-hole capacitor and methods of forming Grant 9,078,373 - Lamorey , et al. July 7, 2	2015-07-07
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures Grant 9,057,760 - Lacroix , et al. June 16, 2	2015-06-16
Packages for three-dimensional die stacks Grant 9,059,127 - Lamorey , et al. June 16, 2	2015-06-16
Chamfered corner crackstop for an integrated circuit chip Grant 9,059,191 - Lamorey , et al. June 16, 2	2015-06-16
Power distribution for 3D semiconductor package Grant 9,018,040 - Lamorey , et al. April 28, 2	2015-04-28
Semiconductor test and monitoring structure to detect boundaries of safe effective modulus Grant 9,006,739 - Crain, Jr. , et al. April 14, 2	2015-04-14
Elongated via structures Grant 8,999,846 - LaCroix , et al. April 7, 2	2015-04-07
Power Distribution For 3d Semiconductor Package App 20150091131 - Lamorey; Mark C. ; et al.	2015-04-02
Semiconductor Test And Monitoring Structure To Detect Boundaries Of Safe Effective Modulus App 20150044787 - Crain, JR.; James V. ; et al.	2015-02-12
Organic module EMI shielding structures and methods Grant 8,952,503 - Brodsky , et al. February 10, 2	2015-02-10
Organic Module Emi Shielding Structures And Methods App 20150033554 - Brodsky; William L. ; et al.	2015-02-05
Elongated Via Structures App 20140227874 - LaCroix; Luke D. ; et al.	2014-08-14
Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections Grant 8,796,133 - Bonilla , et al. August 5, 2	2014-08-05
Organic Module Emi Shielding Structures And Methods App 20140210059 - Brodsky; William L. ; et al.	2014-07-31
Elongated via structures Grant 8,759,977 - LaCroix , et al. June 24, 2	2014-06-24
Elastic modulus mapping of a chip carrier in a flip chip package Grant 8,756,546 - Cohen , et al. June 17, 2	2014-06-17
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Grant 8,653,662 - LaCroix , et al. February 18, 2	2014-02-18
Elastic Modulus Mapping Of A Chip Carrier In A Flip Chip Package App 20140033148 - Cohen; Erwin B. ; et al.	2014-01-30
Optimization Metallization For Prevention Of Dielectric Cracking Under Controlled Collapse Chip Connections App 20140021622 - Bonilla; Griselda ; et al.	2014-01-23
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability Grant 8,586,982 - LaCroix , et al. November 19, 2	2013-11-19
Structure And Method For Monitoring Stress Induced Failures In Interlevel Dielectric Layers Of Solder Bump Integrated Circuits App 20130292817 - LaCroix; Luke D. ; et al.	2013-11-07
Elongated Via Structures App 20130285251 - LaCroix; Luke D. ; et al.	2013-10-31
Semiconductor Test And Monitoring Structure To Detect Boundaries Of Safe Effective Modulus App 20130270558 - Crain, JR.; James V. ; et al.	2013-10-17
Chamfered Corner Crackstop For An Integrated Circuit Chip App 20130099391 - Lamorey; Mark C. ; et al.	2013-04-25
Packaging Identical Chips In A Stacked Structure App 20130049834 - Colgan; Evan G. ; et al.	2013-02-28
Circuit For Detecting Structural Defects In An Integrated Circuit Chip, Methods Of Use And Manufacture And Design Structures App 20120187953 - LACROIX; Luke D. ; et al.	2012-07-26
Semiconductor Test Chip Device To Mimic Field Thermal Mini-cycles To Assess Reliability App 20120049874 - LaCroix; Luke D. ; et al.	2012-03-01
Electrical property altering, planar member with solder element in IC chip package Grant 8,044,512 - Behun , et al. October 25, 2	2011-10-25
Electrical Property Altering, Planar Member With Solder Element In Ic Chip Package App 20100327405 - Behun; J. Richard ; et al.	2010-12-30
Swimming Pool Covering Sheet, System, And Method Of Use App 20100281610 - Stone; David B.	2010-11-11
Packaging reliability superchips Grant 7,560,950 - Blanchet , et al. July 14, 2	2009-07-14
Vents With Signal Image For Signal Return Path App 20080127485 - Budell; Timothy W. ; et al.	2008-06-05
Packaging reliability superchips App 20080088335 - Blanchet; Jason E. ; et al.	2008-04-17
Vents with signal image for signal return path Grant 7,351,917 - Budell , et al. April 1, 2	2008-04-01
Packaging reliability super chips Grant 7,348,792 - Blanchet , et al. March 25, 2	2008-03-25
Dual pitch contact pad footprint for flip-chip chips and modules Grant 7,196,908 - Budell , et al. March 27, 2	2007-03-27
Packaging reliability super chips App 20060290372 - Blanchet; Jason E. ; et al.	2006-12-28
Packaging reliability superchips Grant 7,102,377 - Blanchet , et al. September 5, 2	2006-09-05
Vents with signal image for signal return path App 20060108142 - Budell; Timothy W. ; et al.	2006-05-25
Method of making an electronic package Grant 7,024,764 - Kresge , et al. April 11, 2	2006-04-11
Vents with signal image for signal return path Grant 6,977,345 - Budell , et al. December 20, 2	2005-12-20
Method of making a multi-layered interconnect structure Grant 6,829,823 - Downes, Jr. , et al. December 14, 2	2004-12-14
Dual pitch contact pad footprint for flip-chip chips and modules App 20040246691 - Budell, Timothy W. ; et al.	2004-12-09
Optically clear high temperature resistant silicone polymers of high refractive index App 20040198924 - Young, Nickelous David ; et al.	2004-10-07
Radial contact pad footprint and wiring for electrical components Grant 6,793,500 - Budell , et al. September 21, 2	2004-09-21
LCD cover optical structure and method Grant 6,639,638 - Kodnani , et al. October 28, 2	2003-10-28
Vents with signal image for signal return path App 20030127249 - Budell, Timothy W. ; et al.	2003-07-10
High density design for organic chip carriers Grant 6,538,213 - Carden , et al. March 25, 2	2003-03-25
Electronic package with high density interconnect layer App 20020085364 - Downes, Francis J. JR. ; et al.	2002-07-04
Electronic package for electronic components and method of making same App 20020059723 - Kresge, John S. ; et al.	2002-05-23
Electronic package with high density interconnect layer Grant 6,373,717 - Downes, Jr. , et al. April 16, 2	2002-04-16
Tented plated through-holes and method for fabrication thereof App 20010022392 - Kresge, John S. ; et al.	2001-09-20
Soccer training system Grant 5,669,833 - Stone September 23, 1	1997-09-23
Passive interposer including at least one passive electronic component Grant 5,530,288 - Stone June 25, 1	1996-06-25
Fabrication tool and method for parallel processor structure and package Grant 5,403,420 - Gall , et al. April 4, 1	1995-04-04