Stoeckl; Stephan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stoeckl; Stephan.The latest application filed is for "stress relief die implementation".

Company Profile

10.9.18

Stoeckl; Stephan - Schwandorf DE
Stoeckl; Stephan - Schwandorr DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Patch antennas stitched to systems in packages and methods of assembling same Grant 11,374,323 - Augustin , et al. June 28, 2	2022-06-28
Stress Relief Die Implementation App 20210193594 - STOECKL; Stephan ; et al.	2021-06-24
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory Grant 11,018,114 - Waidhas , et al. May 25, 2	2021-05-25
Embedded-bridge Substrate Connectors And Methods Of Assembling Same App 20200328182 - WAIDHAS; Bernd ; et al.	2020-10-15
Embedded-bridge substrate connectors and methods of assembling same Grant 10,727,197 - Waidhas , et al.	2020-07-28
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same App 20200144723 - Augustin; Andreas ; et al.	2020-05-07
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory App 20190341371 - Waidhas; Bernd ; et al.	2019-11-07
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory Grant 10,403,602 - Waidhas , et al. Sep	2019-09-03
Electronic Component Alignment Device And Method App 20190103347 - Seidemann; Georg ; et al.	2019-04-04
Smart Accelerometer Cantilever App 20190004083 - Koller; Sonja ; et al.	2019-01-03
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory App 20190006318 - Waidhas; Bernd ; et al.	2019-01-03
Bent-bridge semiconductive apparatus Grant 10,141,265 - Waidhas , et al. Nov	2018-11-27
Embedded-bridge Substrate Connectors And Methods Of Assembling Same App 20180277512 - Waidhas; Bernd ; et al.	2018-09-27
Bent-bridge Semiconductive Apparatus App 20180190589 - Waidhas; Bernd ; et al.	2018-07-05
Contact pads for integrated circuit packages Grant 9,368,461 - Albers , et al. June 14, 2	2016-06-14
Contact Pads For Integrated Circuit Packages App 20150333022 - Albers; Sven ; et al.	2015-11-19
Module with carrier element Grant 7,709,936 - Bauer , et al. May 4, 2	2010-05-04
Electronic module and method for the production thereof Grant 7,602,614 - Bauer , et al. October 13, 2	2009-10-13
Module With Carrier Element App 20080112141 - Bauer; Michael ; et al.	2008-05-15
Electronic module and method for the production thereof App 20060250781 - Bauer; Michael ; et al.	2006-11-09
Electronic component with cavity fillers made from thermoplast and method for production thereof App 20060088954 - Bauer; Michael ; et al.	2006-04-27
Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module Grant 6,940,156 - Bauer , et al. September 6, 2	2005-09-06
Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module App 20040075172 - Bauer, Michael ; et al.	2004-04-22

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