loadpatents
name:-0.0064280033111572
name:-0.0053019523620605
name:-0.00037384033203125
Stoeckgen; Uwe Patent Filings

Stoeckgen; Uwe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stoeckgen; Uwe.The latest application filed is for "processes for forming integrated circuits with post-patterning treament".

Company Profile
0.6.8
  • Stoeckgen; Uwe - Dresden DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
Grant 8,951,900 - Preusse , et al. February 10, 2
2015-02-10
Processes For Forming Integrated Circuits With Post-patterning Treament
App 20140024213 - Hintze; Bernd ;   et al.
2014-01-23
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
Grant 8,622,783 - Kiesel , et al. January 7, 2
2014-01-07
Contact Elements Of A Semiconductor Device Formed By Electroless Plating And Excess Material Removal With Reduced Sheer Forces
App 20130237057 - Preusse; Axel ;   et al.
2013-09-12
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
Grant 8,450,197 - Preusse , et al. May 28, 2
2013-05-28
Contact Elements of a Semiconductor Device Formed by Electroless Plating and Excess Material Removal with Reduced Sheer Forces
App 20110244679 - Preusse; Axel ;   et al.
2011-10-06
Method And System For Controlling Chemical Mechanical Polishing By Controllably Moving A Slurry Outlet
App 20110237161 - Kiesel; Axel ;   et al.
2011-09-29
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
Grant 7,980,922 - Kiesel , et al. July 19, 2
2011-07-19
Cmp System Having An Eddy Current Sensor Of Reduced Height
App 20080242195 - Heinrich; Jens ;   et al.
2008-10-02
Method And System For Controlling Chemical Mechanical Polishing By Taking Zone Specific Substrate Data Into Account
App 20080242196 - Marxsen; Gerd ;   et al.
2008-10-02
Method And System For Controlling Chemical Mechanical Polishing By Controllably Moving A Slurry Outlet
App 20080132152 - Kiesel; Axel ;   et al.
2008-06-05

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