Stoakley; Diane M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stoakley; Diane M..The latest application filed is for "fabrication of nanovoid-imbedded bismuth telluride with low dimensional system".

Company Profile

0.13.5

Stoakley; Diane M. - Ashland VA US
Stoakley; Diane M. - Yorktown VA
Stoakley; Diane M. - Poquoson VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication of nanovoid-imbedded bismuth telluride with low dimensional system Grant 8,529,825 - Chu , et al. September 10, 2	2013-09-10
Fabrication of advanced thermoelectric materials by hierarchical nanovoid generation Grant 8,083,986 - Choi , et al. December 27, 2	2011-12-27
Fabrication of Nanovoid-Imbedded Bismuth Telluride with low dimensional system App 20110117690 - Chu; Sang-Hyon ; et al.	2011-05-19
Laser-induced fabrication of metallic interlayers and patterns in polyimide films Grant 7,758,927 - Miner , et al. July 20, 2	2010-07-20
Fabrication of advanced thermoelectric materials by hierarchical nanovoid generation App 20090185942 - Choi, SR.; Sang Hyouk ; et al.	2009-07-23
Graded index silicon geranium on lattice matched silicon geranium semiconductor alloy Grant 7,514,726 - Park , et al. April 7, 2	2009-04-07
Graded index silicon geranium on lattice matched silicon geranium semiconductor alloy App 20070222034 - Park; Yeonjoon ; et al.	2007-09-27
Laser-induced fabrication of metallic interlayers and patterns in polyimide films App 20050233154 - Miner, Gilda A. ; et al.	2005-10-20
Process for the simultaneous formation of surface and sub-surface metallic layers in polymer films App 20050119390 - Gaddy, Gregory A. ; et al.	2005-06-02
Electrically conductive polyimide film containing gold (III) ions, composition, and process of making Grant 5,575,955 - Caplan , et al. November 19, 1	1996-11-19
Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature Grant 5,376,209 - Stoakley , et al. December 27, 1	1994-12-27
Polyimide processing additives Grant 5,272,248 - Pratt , et al. December 21, 1	1993-12-21
Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature Grant 5,248,519 - Stoakley , et al. September 28, 1	1993-09-28
Polyimide processing additives Grant 5,116,939 - Fletcher , et al. May 26, 1	1992-05-26
Process for lowering the dielectric constant of polyimides using diamic acid additives Grant 4,895,972 - Stoakley , et al. January 23, 1	1990-01-23
Process for improving moisture resistance of epoxy resins by addition of chromium ions Grant 4,510,277 - St. Clair , et al. April 9, 1	1985-04-09
Process for improving mechanical properties of epoxy resins by addition of cobalt ions Grant 4,473,674 - Stoakley , et al. September 25, 1	1984-09-25

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