STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
Patent Applications and Registrations
Patent applications and USPTO patent grants for STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD.The latest application filed is for "electronic device with first and second contact pads and related methods".
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD - Shenzhen CN
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD. - Shenzhen CN
| Patent | Date |
|---|---|
| Electronic Device With First And Second Contact Pads And Related Methods App 20150155215 - LUAN; Jing-En | 2015-06-04 |
| Image Detector With Lens Assembly And Related Methods App 20150029384 - Luan; Jing-En | 2015-01-29 |
| Proximity Detector Device With Interconnect Layers And Related Methods App 20140319548 - LUAN; Jing-En | 2014-10-30 |
| Image Sensor Device With Aligned Ir Filter And Dielectric Layer And Related Methods App 20140184809 - LUAN; Jing-En | 2014-07-03 |
| Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame Grant 8,736,038 - Xiong , et al. May 27, 2 | 2014-05-27 |
| Imaging Device With Adhesive Filling Openings And Related Methods App 20140092297 - LUAN; Jing-En | 2014-04-03 |
| Lead Frame And Packaging Method App 20130075885 - Xiong; HuiJun ; et al. | 2013-03-28 |
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