Stierman; Roger J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stierman; Roger J..The latest application filed is for "fixture and method for uniform electroless metal deposition on integrated circuit bond pads".

Company Profile

0.6.8

Stierman; Roger J. - Dallas TX
Stierman; Roger J. - Garland TX
Stierman; Roger J. - Richardson TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads Grant 7,071,013 - Amador , et al. July 4, 2	2006-07-04
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20050217574 - Amador, Gonzalo ; et al.	2005-10-06
Method for reworking metal layers on integrated circuit bond pads Grant 6,821,791 - Stierman , et al. November 23, 2	2004-11-23
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20040118693 - Amador, Gonzalo ; et al.	2004-06-24
Method for reworking metal layers on integrated circuit bond pads App 20030153107 - Stierman, Roger J. ; et al.	2003-08-14
Micromechanical device contact terminals free of particle generation App 20030107137 - Stierman, Roger J. ; et al.	2003-06-12
Structure and method for bond pads of copper-metallized integrated circuits App 20030071319 - Stierman, Roger J. ; et al.	2003-04-17
Method for reworking metal layers on integrated circuit bond pads Grant 6,534,327 - Stierman , et al. March 18, 2	2003-03-18
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20010047944 - Amador, Gonzalo ; et al.	2001-12-06
Method for reworking metal layers on integrated circuit bond pads App 20010046721 - Stierman, Roger J. ; et al.	2001-11-29
Structure and method for bond pads of copper-metallized integrated circuits App 20010033020 - Stierman, Roger J. ; et al.	2001-10-25
Fixture and a method for plating contact bumps for integrated circuits Grant 5,024,746 - Stierman , et al. June 18, 1	1991-06-18
Insulated substrate for flip-chip integrated circuit device Grant 4,979,015 - Stierman , et al. December 18, 1	1990-12-18
Fixture and a method for plating contact bumps for integrated circuits Grant 4,931,149 - Stierman , et al. June 5, 1	1990-06-05

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