Stiborek; Leon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stiborek; Leon.The latest application filed is for "laser ablation surface treatment for microelectronic assembly".
- Stiborek; Leon - Dallas TX
| Patent | Date |
|---|---|
| Molded packaged antenna Grant 11,271,296 - Stiborek , et al. March 8, 2 | 2022-03-08 |
| Laser Ablation Surface Treatment For Microelectronic Assembly App 20200273720 - Stiborek; Leon | 2020-08-27 |
| Molded Packaged Antenna App 20190148823 - STIBOREK; Leon ; et al. | 2019-05-16 |
| Stress And Collapse Resistant Interconnect For Mounting An Integrated Circuit Package To A Substrate App 20080158842 - Stiborek; Leon | 2008-07-03 |
| Underfill Dispense At Substrate Aperture App 20080085573 - Odegard; Charles Anthony ; et al. | 2008-04-10 |
| Method for dicing and singulating substrates Grant 7,244,664 - Blair , et al. July 17, 2 | 2007-07-17 |
| Underfill dispense at substrate aperture App 20060234427 - Odegard; Charles Anthony ; et al. | 2006-10-19 |
| Method for dicing and singulating substrates App 20050095816 - Blair, David B. ; et al. | 2005-05-05 |
| Integrated circuit package with spacer App 20040037059 - Stiborek, Leon ; et al. | 2004-02-26 |
| Particle-filled semiconductor attachment material App 20040007780 - Hundt, Paul Joseph ; et al. | 2004-01-15 |
| Dicing saw having an annularly supported dicing blade App 20030136394 - Blair, David B. ; et al. | 2003-07-24 |
| Restrained center core anisotropically conductive adhesive Grant 6,052,286 - Worthen , et al. April 18, 2 | 2000-04-18 |
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