Stermer, Jr.; William C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stermer, Jr.; William C..The latest application filed is for "microelectronic packages including patterned die attach material and methods for the fabrication thereof".
- Stermer, Jr.; William C. - Chandler AZ US
| Patent | Date |
|---|---|
| Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture Grant 9,510,495 - Hooper , et al. November 29, 2 | 2016-11-29 |
| Microelectronic packages including patterned die attach material and methods for the fabrication thereof Grant 8,962,389 - Stermer, Jr. , et al. February 24, 2 | 2015-02-24 |
| Microelectronic Packages Including Patterned Die Attach Material And Methods For The Fabrication Thereof App 20140353772 - Stermer, JR.; William C. ; et al. | 2014-12-04 |
| Integrated circuit package and method of forming the same Grant 8,890,308 - Hooper , et al. November 18, 2 | 2014-11-18 |
| Electronic Devices With Cavity-type, Permeable Material Filled Packages, And Methods Of Their Manufacture App 20140146509 - HOOPER; STEPHEN R. ; et al. | 2014-05-29 |
| Integrated Circuit Package And Method Of Forming The Same App 20130264692 - Hooper; Stephen R. ; et al. | 2013-10-10 |
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