Stering; Bernhard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stering; Bernhard.The latest application filed is for "method for manufacturing optical sensor arrangements and housing for an optical sensor".

Company Profile

4.8.8

Stering; Bernhard - Stainz AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing optical sensor arrangements and housing for an optical sensor Grant 10,978,507 - Koenig , et al. April 13, 2	2021-04-13
Method for Manufacturing Optical Sensor Arrangements And Housing For An Optical Sensor App 20190267424 - KOENIG; Sonja ; et al.	2019-08-29
Dicing method Grant 10,256,147 - Schrems , et al. April 9, 2	2019-04-09
Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device Grant 10,217,715 - Schrems , et al. Feb	2019-02-26
Method for cutting a carrier for electrical components Grant 9,961,777 - Stering May 1, 2	2018-05-01
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging Grant 9,917,012 - Stering March 13, 2	2018-03-13
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method Grant 9,842,946 - Minixhofer , et al. December 12, 2	2017-12-12
Dicing Method For Wafer-level Packaging And Semiconductor Chip With Dicing Structure Adapted For Wafer-level Packaging App 20170200647 - STERING; Bernhard	2017-07-13
Semiconductor Device With A Bump Contact On A Tsv Comprising A Cavity And Method Of Producing Such A Semiconductor Device App 20170179056 - SCHREMS; Martin ; et al.	2017-06-22
Semiconductor Device Comprising An Emitter Of Radiation And A Photosensor And Appertaining Production Method App 20170125613 - MINIXHOFER; Rainer ; et al.	2017-05-04
Dicing Method App 20170062277 - SCHREMS; Martin ; et al.	2017-03-02
Method for producing thin semiconductor components Grant 9,105,645 - Stering , et al. August 11, 2	2015-08-11
Method For Producing Thin Semiconductor Components App 20140349462 - Stering; Bernhard ; et al.	2014-11-27
Method For Cutting A Carrier For Electrical Components App 20140118974 - Stering; Bernhard	2014-05-01

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