Stepniak; Frank
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stepniak; Frank.The latest application filed is for "conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips".
Company Profile
0.23.26
- Stepniak; Frank - Allen TX
- Stepniak; Frank - Andover NJ
- Stepniak; Frank - Dallas TX
- Stepniak; Frank - Noblesville IN
Patent Activity
| Patent | Date |
|---|---|
| Electronic device package with vertically integrated capacitors Grant 10,104,764 - Stepniak , et al. October 16, 2 | 2018-10-16 |
| Discrete device mounted on substrate Grant 9,899,339 - Romig , et al. February 20, 2 | 2018-02-20 |
| Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips Grant 9,852,979 - Romig , et al. December 26, 2 | 2017-12-26 |
| Conductive Through-Polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips App 20170047283 - Romig; Matthew D. ; et al. | 2017-02-16 |
| Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips Grant 9,572,261 - Romig , et al. February 14, 2 | 2017-02-14 |
| Conductive Through-Polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips App 20160286654 - Romig; Matthew D. ; et al. | 2016-09-29 |
| Method for embedding controlled-cavity MEMS package in integration board Grant 9,321,631 - Manack , et al. April 26, 2 | 2016-04-26 |
| Electronic Device Package With Vertically Integrated Capacitors App 20150271913 - STEPNIAK; FRANK ; et al. | 2015-09-24 |
| Integrated circuit package with printed circuit layer Grant 9,111,845 - Romig , et al. August 18, 2 | 2015-08-18 |
| Embedded Die Package App 20150061103 - Manack; Christopher Daniel ; et al. | 2015-03-05 |
| Electronic assembly with three dimensional inkjet printed traces Grant 8,945,986 - Romig , et al. February 3, 2 | 2015-02-03 |
| Method For Embedding Controlled-cavity Mems Package In Integration Board App 20150004739 - Manack; Christopher Daniel ; et al. | 2015-01-01 |
| Integrated Circuit Package With Printed Circuit Layer App 20140361402 - Romig; Matthew David ; et al. | 2014-12-11 |
| Methods for embedding controlled-cavity MEMS package in integration board Grant 8,866,237 - Manack , et al. October 21, 2 | 2014-10-21 |
| Integrated circuit package with printed circuit layer Grant 8,847,349 - Romig , et al. September 30, 2 | 2014-09-30 |
| Electronic assembly with three dimensional inkjet printed traces Grant 8,816,513 - Romig , et al. August 26, 2 | 2014-08-26 |
| Integrated Circuit Package With Printed Circuit Layer App 20140175599 - Romig; Matthew David ; et al. | 2014-06-26 |
| Discrete Device Mounted On Substrate App 20140124939 - Romig; Matthew David ; et al. | 2014-05-08 |
| Electronic Assembly with Three Dimensional Inkjet Printed Traces App 20140127856 - Romig; Matthew David ; et al. | 2014-05-08 |
| Electronic Assembly With Three Dimensional Inkjet Printed Traces App 20140054795 - Romig; Matthew David ; et al. | 2014-02-27 |
| Methods for Embedding Controlled-Cavity MEMS Package in Integration Board App 20130221455 - Manack; Christopher D. ; et al. | 2013-08-29 |
| Wafer Chip Scale Package Connection Scheme App 20120211884 - Stepniak; Frank ; et al. | 2012-08-23 |
| High current switch and method of operation Grant 7,754,992 - Stepniak , et al. July 13, 2 | 2010-07-13 |
| High current switch and method of operation App 20090289037 - Stepniak; Frank ; et al. | 2009-11-26 |
| High current switch and method of operation Grant 7,579,572 - Stepniak , et al. August 25, 2 | 2009-08-25 |
| High current switch and method of operation App 20080254660 - Stepniak; Frank ; et al. | 2008-10-16 |
| High current switch and method of operation Grant 7,397,012 - Stepniak , et al. July 8, 2 | 2008-07-08 |
| Laterally Interconnected IC Packages and Methods App 20080157320 - Harrison; Ray D. ; et al. | 2008-07-03 |
| Integrated circuit with low-stress under-bump metallurgy App 20070029669 - Stepniak; Frank ; et al. | 2007-02-08 |
| High current switch and method of operation App 20060266630 - Stepniak; Frank ; et al. | 2006-11-30 |
| No-flow underfill process and material therefor Grant 6,943,058 - Chaudhuri , et al. September 13, 2 | 2005-09-13 |
| Wafer-applied underfill process Grant 6,916,684 - Stepniak , et al. July 12, 2 | 2005-07-12 |
| Flip-chip interconnect with increased current-carrying capability App 20050046024 - Mithal, Pankaj ; et al. | 2005-03-03 |
| Flip-chip Interconnect With Increased Current-carrying Capability App 20040251542 - Mithal, Pankaj ; et al. | 2004-12-16 |
| Flip-chip interconnected with increased current-carrying capability Grant 6,822,327 - Mithal , et al. November 23, 2 | 2004-11-23 |
| Lead-based solder alloys containing copper Grant 6,811,892 - Yeh , et al. November 2, 2 | 2004-11-02 |
| Conductive adhesive material with metallurgically-bonded conductive particles Grant 6,802,446 - Chaudhuri , et al. October 12, 2 | 2004-10-12 |
| Wafer-applied underfill process App 20040185601 - Stepniak, Frank ; et al. | 2004-09-23 |
| No-flow underfill process and material therefor App 20040185602 - Chaudhuri, Arun K. ; et al. | 2004-09-23 |
| Lead-based solder alloys containing copper App 20040035909 - Yeh, Shing ; et al. | 2004-02-26 |
| Conductive adhesive material with metallurgically-bonded conductive particles App 20030146266 - Chaudhuri, Arun K. ; et al. | 2003-08-07 |
| Elbow canister fuseholder Grant 6,491,548 - Stepniak , et al. December 10, 2 | 2002-12-10 |
| Surface bumping method and structure formed thereby Grant 6,375,062 - Higdon , et al. April 23, 2 | 2002-04-23 |
| Elbow canister fuseholder App 20010044242 - Stepniak, Frank ; et al. | 2001-11-22 |
| Method of solder bumping a circuit component Grant 6,281,106 - Higdon , et al. August 28, 2 | 2001-08-28 |
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