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Patent applications and USPTO patent grants for Stepniak; Dave Charles.The latest application filed is for "subring for semiconductor dies".
Patent | Date |
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Die matrix expander with partitioned subring Grant 11,171,031 - Sherbin , et al. November 9, 2 | 2021-11-09 |
Subring For Semiconductor Dies App 20210183683 - Sherbin; Matthew John ;   et al. | 2021-06-17 |
Subring For Semiconductor Dies App 20200075386 - SHERBIN; MATTHEW JOHN ;   et al. | 2020-03-05 |
Laser Dicing For Singulation App 20200051860 - Wyant; Michael Todd ;   et al. | 2020-02-13 |
Die Matrix Expander With Partitioned Subring App 20200027772 - SHERBIN; MATTHEW JOHN ;   et al. | 2020-01-23 |
Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor Grant 6,445,069 - Ling , et al. September 3, 2 | 2002-09-03 |
Electroless Ni/pd/au Metallization Structure For Copper Interconnect Substrate And Method Therefor App 20020096765 - Ling, Jamin ;   et al. | 2002-07-25 |
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