Stepniak; Dave Charles
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stepniak; Dave Charles.The latest application filed is for "subring for semiconductor dies".
- Stepniak; Dave Charles - Allen TX
- Stepniak; Dave Charles - Phoenix AZ
| Patent | Date |
|---|---|
| Die matrix expander with partitioned subring Grant 11,171,031 - Sherbin , et al. November 9, 2 | 2021-11-09 |
| Subring For Semiconductor Dies App 20210183683 - Sherbin; Matthew John ; et al. | 2021-06-17 |
| Subring For Semiconductor Dies App 20200075386 - SHERBIN; MATTHEW JOHN ; et al. | 2020-03-05 |
| Laser Dicing For Singulation App 20200051860 - Wyant; Michael Todd ; et al. | 2020-02-13 |
| Die Matrix Expander With Partitioned Subring App 20200027772 - SHERBIN; MATTHEW JOHN ; et al. | 2020-01-23 |
| Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor Grant 6,445,069 - Ling , et al. September 3, 2 | 2002-09-03 |
| Electroless Ni/pd/au Metallization Structure For Copper Interconnect Substrate And Method Therefor App 20020096765 - Ling, Jamin ; et al. | 2002-07-25 |
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