Stephenson; William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stephenson; William.The latest application filed is for "techniques for high-throughput fluid exchange in droplets".
- Stephenson; William - Brooklyn NY
- Stephenson; William - Meridian ID
| Patent | Date |
|---|---|
| Techniques for high-throughput fluid exchange in droplets App 20210146365 - Stephenson; William | 2021-05-20 |
| Methods for coupling a flowable conductive material to microelectronic substrates Grant 6,995,026 - Moxham , et al. February 7, 2 | 2006-02-07 |
| Method and apparatus for supporting microelectronic substrates App 20050242437 - Moxham, Stephen ; et al. | 2005-11-03 |
| Microelectronic assemblies and electronic devices including connection structures with multiple elongated members Grant 6,936,916 - Moxham , et al. August 30, 2 | 2005-08-30 |
| Apparatus for supporting microelectronic substrates Grant 6,870,276 - Moxham , et al. March 22, 2 | 2005-03-22 |
| Microelectronic assemblies, electronic devices, and apparatuses for supporting microelectronic substrates App 20040159946 - Moxham, Stephen ; et al. | 2004-08-19 |
| Methods for coupling a flowable conductive material to microelectronic substrates App 20040159921 - Moxham, Stephen ; et al. | 2004-08-19 |
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