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name:-0.00043988227844238
name:-0.0029890537261963
name:-0.00036191940307617
Stenstr.o slashed.m; Theiss Patent Filings

Stenstr.o slashed.m; Theiss

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stenstr.o slashed.m; Theiss.The latest application filed is for "successive samples analysis method and analysis apparatus".

Company Profile
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  • Stenstr.o slashed.m; Theiss - S.o slashed.nderborg DK
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Successive samples analysis method and analysis apparatus
Grant 5,773,298 - Lynggaard , et al. June 30, 1
1998-06-30
Device for analyzing a fluid medium
Grant 5,695,719 - Lynggaard , et al. December 9, 1
1997-12-09

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