Stelzl; Alois

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stelzl; Alois.The latest application filed is for "mems component and method for encapsulating mems components".

Company Profile

0.47.34

Stelzl; Alois - Munich DE
STELZL; Alois - Munchen DE
Stelzl; Alois - Muenchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric component with sensitive component structures and method for producing an electric component with sensitive component structures Grant 11,245,977 - Bauer , et al. February 8, 2	2022-02-08
MEMS component and method for encapsulating MEMS components Grant 10,164,166 - Kruger , et al. Dec	2018-12-25
Mems Component And Method For Encapsulating Mems Components App 20180097172 - KRUGER; Hans ; et al.	2018-04-05
MEMS component and method for encapsulating MEMS components Grant 9,853,204 - Kruger , et al. December 26, 2	2017-12-26
Simple To Produce Electric Component And Method For Producing An Electric Component App 20170272855 - BAUER; Christian ; et al.	2017-09-21
Wafer-level package and method for production thereof Grant 9,647,196 - Bauer , et al. May 9, 2	2017-05-09
Component and method for producing a component Grant 9,382,110 - Bauer , et al. July 5, 2	2016-07-05
MEMS Component and Method for Encapsulating MEMS Components App 20150325780 - Kruger; Hans ; et al.	2015-11-12
Method for connecting a plurality of unpackaged substrates Grant 9,165,905 - Krueger , et al. October 20, 2	2015-10-20
Method and apparatus for producing chip devices, and chip device produced by means of the method Grant 9,114,979 - Gerner , et al. August 25, 2	2015-08-25
Encapsulation of an MEMS component and a method for producing said component Grant 9,006,868 - Bauer , et al. April 14, 2	2015-04-14
MEMS microphone and method for producing the MEMS microphone Grant 8,865,499 - Pahl , et al. October 21, 2	2014-10-21
Component and Method for Producing a Component App 20140226285 - Bauer; Christian ; et al.	2014-08-14
Hermetically sealed housing for electronic components and manufacturing method Grant 8,759,677 - Bauer , et al. June 24, 2	2014-06-24
Wafer-Level Package and Method for Production Thereof App 20140111062 - Bauer; Christian ; et al.	2014-04-24
Element with optical marking, manufacturing method, and use Grant 8,691,369 - Schmajew , et al. April 8, 2	2014-04-08
Encapsulation Of An Mems Component And A Method For Producing Said Component App 20130341773 - Bauer; Christian ; et al.	2013-12-26
Semiconductor chip arrangement with sensor chip and manufacturing method Grant 8,580,613 - Feiertag , et al. November 12, 2	2013-11-12
Component and Method for Producing a Component App 20130214405 - Bauer; Christian ; et al.	2013-08-22
MEMS Microphone And Method For Producing The MEMS Microphone App 20130140656 - Pahl; Wolfgang ; et al.	2013-06-06
MEMS package and method for the production thereof Grant 8,432,007 - Leidl , et al. April 30, 2	2013-04-30
Method for producing a MEMS package Grant 8,404,516 - Bauer , et al. March 26, 2	2013-03-26
Electrical component and production method Grant 8,294,535 - Feiertag , et al. October 23, 2	2012-10-23
Method for Connecting a Plurality of Unpackaged Substrates App 20120159778 - Krueger; Hans ; et al.	2012-06-28
MEMS package and method for the production thereof Grant 8,169,041 - Pahl , et al. May 1, 2	2012-05-01
Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method App 20120061778 - Gerner; Michael ; et al.	2012-03-15
MEMS component and method for production Grant 8,110,962 - Bauer , et al. February 7, 2	2012-02-07
Semiconductor Chip Arrangement With Sensor Chip And Manufacturing Method App 20110233690 - Feiertag; Gregor ; et al.	2011-09-29
MEMS Package and Method for the Production Thereof App 20110186943 - Pahl; Wolfgang ; et al.	2011-08-04
Hermetically Sealed Housing For Electronic Components And Manufacturing Method App 20110114355 - Bauer; Christian ; et al.	2011-05-19
MEMS Component and Method for Production App 20100148285 - Bauer; Christian ; et al.	2010-06-17
Method for Producing a MEMS Package App 20100127377 - Bauer; Christian ; et al.	2010-05-27
Flip-chip component production method Grant 7,673,386 - Stelzl , et al. March 9, 2	2010-03-09
Component arrangement provided with a carrier substrate Grant 7,608,789 - Kruger , et al. October 27, 2	2009-10-27
Electrical component and production method App 20090224851 - Feiertag; Gregor ; et al.	2009-09-10
Method for hermetically encapsulating a component Grant 7,552,532 - Stelzl , et al. June 30, 2	2009-06-30
Encapsulated electrical component and production method Grant 7,544,540 - Bauer , et al. June 9, 2	2009-06-09
Element with Optical Marking, Manufacturing Method, and Use App 20090104415 - Schmajew; Alexander ; et al.	2009-04-23
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method Grant 7,518,201 - Stelzl , et al. April 14, 2	2009-04-14
Flip-Chip Component and Method for its Production App 20090071710 - Stelzl; Alois ; et al.	2009-03-19
Mems Package and Method for the Production Thereof App 20090001553 - Pahl; Wolfgang ; et al.	2009-01-01
Encapsulated electronic component and production method Grant 7,388,281 - Krueger , et al. June 17, 2	2008-06-17
Component Arrangement Provided With a Carrier Substrate App 20080038577 - Kruger; Hans ; et al.	2008-02-14
Encapsulated Electrical Component and Production Method App 20070222056 - Bauer; Christian ; et al.	2007-09-27
Method for the hermetic encapsulation of a component Grant 7,259,041 - Stelzl , et al. August 21, 2	2007-08-21
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method App 20060249802 - Stelzl; Alois ; et al.	2006-11-09
Method for encapsulating an electrical component Grant 7,094,626 - Stelzl , et al. August 22, 2	2006-08-22
Encapsulated electronic component and production method App 20060151203 - Krueger; Hans ; et al.	2006-07-13
Substrate for an electric component and method for the production thereof Grant 6,909,183 - Feiertag , et al. June 21, 2	2005-06-21
Method for the hermetic encapsulation of a component App 20050121785 - Stelzl, Alois ; et al.	2005-06-09
Component with a label Grant 6,838,739 - Stelzl , et al. January 4, 2	2005-01-04
Method for encapsulating an electrical component and surface wave component thus encapsulated App 20040239449 - Stelzl, Alois ; et al.	2004-12-02
Method for hermetically encapsulating a component App 20040237299 - Stelzl, Alois ; et al.	2004-12-02
Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves Grant 6,722,030 - Stelzl , et al. April 20, 2	2004-04-20
Substrate for an electric component and method for the production thereof App 20040058473 - Feiertag, Gregor ; et al.	2004-03-25
Surface acoustic wave component Grant 6,685,168 - Stelzl , et al. February 3, 2	2004-02-03
Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like Grant 6,555,758 - Stelzl , et al. April 29, 2	2003-04-29
Component provided with a description App 20030047806 - Stelzl, Alois ; et al.	2003-03-13
Electronic component, in particular a component operating with surface acoustic waves Grant 6,528,924 - Stelzl , et al. March 4, 2	2003-03-04
Method for producing an electronic component Grant 6,519,822 - Stelzl , et al. February 18, 2	2003-02-18
Method of producing a surface acoustic wave component Grant 6,449,828 - Pahl , et al. September 17, 2	2002-09-17
Method of producing a surface acoustic wave component App 20010010444 - Pahl, Wolfgang ; et al.	2001-08-02
Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production Grant 6,242,842 - Pahl , et al. June 5, 2	2001-06-05
Method of producing an electronic component, in particular a surface acoustic wave component Grant 6,136,175 - Stelzl , et al. October 24, 2	2000-10-24
Method for the production of flip-chip mounting-ready contacts of electrical components Grant 6,057,222 - Pahl , et al. May 2, 2	2000-05-02