Steinius; Ortrud
Patent Applications and Registrations
Patent applications and USPTO patent grants for Steinius; Ortrud.The latest application filed is for "tin-silver solder bumping in electronics manufacture".
- Steinius; Ortrud - Wuppertal DE
| Patent | Date |
|---|---|
| Tin-silver solder bumping in electronics manufacture Grant 7,713,859 - Richardson , et al. May 11, 2 | 2010-05-11 |
| Tin-silver Solder Bumping In Electronics Manufacture App 20070037377 - Richardson; Thomas B. ; et al. | 2007-02-15 |
| Method for bronze galvanic coating App 20060137991 - Zschintzsch; Katrin ; et al. | 2006-06-29 |
| Method for electrodeposition of bronzes App 20050263403 - Zschintzsch, Katrin ; et al. | 2005-12-01 |
| Method for metal coating of substrates Grant 6,589,593 - Hupe , et al. July 8, 2 | 2003-07-08 |
| Process For The Deposition Of A Silver-tin Alloy App 20030024822 - Steinius, Ortrud | 2003-02-06 |
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