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name:-0.020082950592041
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Steiner; Rainer Patent Filings

Steiner; Rainer

Patent Applications and Registrations

Patent applications and USPTO patent grants for Steiner; Rainer.The latest application filed is for "current sensor device".

Company Profile
0.17.20
  • Steiner; Rainer - Regensburg DE
  • Steiner; Rainer - Regengsburg DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Current sensor device
Grant 9,658,296 - Ausserlechner , et al. May 23, 2
2017-05-23
Chip arrangement and a method of manufacturing a chip arrangement
Grant 9,041,226 - Steiner , et al. May 26, 2
2015-05-26
Current Sensor Device
App 20150015249 - AUSSERLECHNER; Udo ;   et al.
2015-01-15
Chip Arrangement And A Method Of Manufacturing A Chip Arrangement
App 20140264950 - Steiner; Rainer ;   et al.
2014-09-18
Semiconductor structure and method for making same
Grant 8,786,085 - Barth , et al. July 22, 2
2014-07-22
Semiconductor structure and method for making same
Grant 8,759,207 - Barth , et al. June 24, 2
2014-06-24
Semiconductor device stack and method for its production
Grant 8,659,135 - Bauer , et al. February 25, 2
2014-02-25
Semiconductor Structure And Method For Making Same
App 20130309864 - BARTH; Hans-Joachim ;   et al.
2013-11-21
Semiconductor Structure And Method For Making Same
App 20130062770 - BARTH; Hans-Joachim ;   et al.
2013-03-14
Device fabricated using an electroplating process
Grant 8,334,202 - Pohl , et al. December 18, 2
2012-12-18
Semiconductor structure and method for making same
Grant 8,330,274 - Barth , et al. December 11, 2
2012-12-11
Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip
Grant 8,330,273 - Brunnbauer , et al. December 11, 2
2012-12-11
Semiconductor Structure And Method For Making Same
App 20120080791 - BARTH; Hans-Joachim ;   et al.
2012-04-05
Semiconductor structure and method for making same
Grant 8,148,257 - Barth , et al. April 3, 2
2012-04-03
Semiconductor Structure And Method For Making Same
App 20120074574 - BARTH; Hans-Joachim ;   et al.
2012-03-29
Semiconductor device including conductive element
Grant 8,072,071 - Steiner , et al. December 6, 2
2011-12-06
Method Of Manufacturing A Semiconductor Device
App 20110291274 - Meyer; Thorsten ;   et al.
2011-12-01
Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
App 20110291256 - Steiner; Rainer ;   et al.
2011-12-01
Device Fabricated Using An Electroplating Process
App 20110101532 - Pohl; Jens ;   et al.
2011-05-05
Semiconductor Device
App 20110024915 - Brunnbauer; Markus ;   et al.
2011-02-03
Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound
Grant 7,863,088 - Brunnbauer , et al. January 4, 2
2011-01-04
Semiconductor Device Including Conductive Element
App 20100207272 - Steiner; Rainer ;   et al.
2010-08-19
Semiconductor component with plastic housing, and process for producing the same
Grant 7,772,105 - Bachmaier , et al. August 10, 2
2010-08-10
Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
Grant 7,638,418 - Bauer , et al. December 29, 2
2009-12-29
Method Of Manufacturing A Semiconducotor Device
App 20090160053 - Meyer; Thorsten ;   et al.
2009-06-25
Semiconductor Device
App 20080284035 - Brunnbauer; Markus ;   et al.
2008-11-20
Semiconductor Component with Plastic Housing, and Process for Producing the Same
App 20080050907 - Bachmaier; Ulrich ;   et al.
2008-02-28
Semiconductor component with plastic housing, and process for producing the same
Grant 7,327,023 - Bachmaier , et al. February 5, 2
2008-02-05
Electronic component with a housing package
Grant 7,319,598 - Steiner , et al. January 15, 2
2008-01-15
Semiconductor Device Stack and Method for Its Production
App 20070278639 - Bauer; Michael ;   et al.
2007-12-06
Wiring Substrate of a Semiconductor Component Comprising External Contact Pads for External Contacts and Method for Producing the Same
App 20070194459 - Bauer; Michael ;   et al.
2007-08-23
Electronic component and electronic configuration
App 20070018308 - Schott; Albert ;   et al.
2007-01-25
Electronic component with a housing package
App 20060126313 - Steiner; Rainer ;   et al.
2006-06-15
Semiconductor component with plastic housing, and process for producing the same
App 20060076667 - Bachmaier; Ulrich ;   et al.
2006-04-13
Semiconductor component with electromagnetic shielding device
Grant 7,009,288 - Bauer , et al. March 7, 2
2006-03-07
Semiconductor component with electromagnetic shielding device
App 20050077596 - Bauer, Michael ;   et al.
2005-04-14

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